Microactuator Mounting Adhesive Partial Curing in Disk Drive
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Solution Overview
Problem
Dual stage actuation (DSA) disk drive suspensions face challenges in achieving improved performance, particularly in the attachment of microactuators to flexures, where existing methods fail to prevent conductive adhesives from wicking and displacing structural adhesives, leading to electrical shorts and reduced manufacturing yields.
Innovation Solution
A method involving the partial curing of structural adhesive before applying conductive adhesive, where the structural adhesive is initially applied in a wet state and partially cured to prevent wicking, followed by full curing of both adhesives to ensure secure attachment and prevent electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive is applied after structural adhesive in wet state, then electrical connection is established, but conductive adhesive wicks and displaces structural adhesive causing electrical shorts
Solution Approach 1:
The structural adhesive is partially cured before applying the conductive adhesive. This preliminary curing action creates a barrier that prevents the conductive adhesive from wicking underneath the microactuator and displacing the structural adhesive, thereby preventing electrical shorts while maintaining reliable electrical connection.
Solution Approach 2:
The viscosity of the structural adhesive is changed by partially curing it, transforming it from a wet, flowable state to a partially cured, more rigid state. This parameter change prevents the conductive adhesive from wicking and displacing it, solving the electrical short problem.
2Object-affected harmful factors
If structural adhesive is fully cured before applying conductive adhesive, then wicking is prevented, but attachment strength is reduced
Solution Approach 1:
Instead of fully curing the structural adhesive before applying conductive adhesive, only partial curing is performed. This partial action is sufficient to prevent wicking of the conductive adhesive while maintaining the flexibility and bonding strength of the structural adhesive, avoiding the strength reduction that would occur with full curing.
3Reliability
If dual stage actuation suspension performance is improved, then manufacturing complexity increases
Solution Approach 1:
The curing process is segmented into two distinct stages: partial curing of the structural adhesive, followed by full curing of both adhesives together. This segmentation allows the process to achieve high reliability DSA suspension performance while managing manufacturing complexity through a systematic, multi-stage approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the attachment of microactuators to flexures by preventing adhesive wicking and electrical shorts, improving manufacturing yields and maintaining structural integrity, thereby enhancing the performance of DSA disk drive suspensions.
Implementation Method 1
partially curing the mass of structural adhesive through a first application of curing energy to the mass of structural adhesive while in the wet state
Implementation Method 2
mounting the microactuator over the flexure such that the structural adhesive, while in the wet state, is located between and in contact with each of the first surface of the flexure and a surface of the microactuator
Data Source
AI summary
Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.