Microanalysis Chip Two-Stage Mold Packaging
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Solution Overview
Problem
Microanalysis chips with integrated microflow channels and detection mechanisms face challenges in mechanical strength and reliability due to their weak current output and fragile structure, which can lead to damage during packaging and affect the accuracy of particle detection.
Innovation Solution
A two-stage mold packaging method is employed, using a primary mold layer of polyimide or resin for the semiconductor microanalysis chip and a secondary mold layer of epoxy resin, with connected liquid introduction and injection holes to enhance mechanical strength and maintain the hollow flow channel structure, while also allowing for accurate liquid introduction and ion current measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a microanalysis chip with integrated microflow channels and detection mechanisms is used, then particle detection capability is achieved, but mechanical strength and reliability deteriorate due to fragile structure
Solution Approach 1:
The packaging structure is divided into multiple functional layers: a first mold layer (resin or polyimide) providing mechanical protection, a second mold layer (epoxy resin) providing additional structural support, and a substrate supporting the microanalysis chip. This segmentation allows each layer to specialize in specific functions, with the lower layers bearing mechanical loads to protect the fragile chip structure while maintaining detection capabilities.
Solution Approach 2:
The patent transitions from a planar chip structure to a three-dimensional multi-layer packaging architecture. By stacking mold layers and support structures above and below the chip plane, mechanical strength is enhanced in the vertical dimension without interfering with the horizontal fluid flow paths necessary for particle detection.
2Strength
If packaging is applied to enhance mechanical strength, then structural reliability is improved, but detection accuracy may deteriorate due to potential damage to flow channels
Solution Approach 1:
The first and second mold layers are designed to provide cushioning protection to the microanalysis chip during packaging and handling. These compliant mold layers absorb mechanical stresses before they can reach the fragile flow channels and detector, preventing damage that would compromise detection accuracy while still providing necessary mechanical strength.
Solution Approach 2:
The mold layers are designed as flexible protective shells that conform to the chip structure. This flexible encapsulation protects the rigid microflow channels and detector from mechanical damage during packaging while maintaining the integrity of the fluid pathways necessary for accurate particle detection.
3Strength
If a two-stage mold packaging method is used, then mechanical strength is improved, but device complexity increases
Solution Approach 1:
The packaging process is segmented into two distinct stages: first forming a protective mold layer around the chip, then adding a second support layer. This segmentation allows each packaging stage to be optimized independently and simplifies the manufacturing process compared to attempting to create a complex single-layer package structure.
Solution Approach 2:
The multi-layer mold structure serves multiple functions simultaneously: mechanical protection, structural support, and potential integration with liquid introduction/injection systems. This multi-functionality reduces the need for additional separate components, thereby managing overall device complexity despite the multi-stage packaging approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-stage mold packaging improves the mechanical strength and reliability of the microanalysis chip, enabling accurate particle detection without damaging the flow channels and enhancing the sensitivity of ion current measurements.
Implementation Method 1
particles and biopolymers included in a sample liquid can be detected by letting the sample liquid flow in a flow channel and acquiring the displacement of the particles, etc., in the sample liquid as an electrical signal by the variation of electrical resistance
Data Source
AI summary
According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.