Microassembly Probe System for Three-Dimensional MEMS Assembly
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Solution Overview
Problem
Current microassembly technologies face challenges in achieving high dexterity, accuracy, and robustness for manipulating micro parts within micron and submicron tolerances, as they often result in mechanical limitations and incompatibility with certain materials, and are prone to positioning errors due to electrostatic forces.
Innovation Solution
A microassembly system utilizing multiple probes with manipulation actuators, a die stage, and multiple microscope cameras configured to provide three distinct workspaces, along with a glue dispenser, enables precise manipulation and placement of micro parts by using active probes and nanopositioners for six degrees of spatial motion and precise orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If single wafer chemical processing is used, then manufacturing simplicity is maintained, but mechanical depth and spatial mechanism capability are limited
Solution Approach 1:
The system segments the assembly process into distinct workspaces (first workspace for grasping, second workspace for orientation, third workspace for placement) and uses multiple independent probes that can operate simultaneously in different spatial planes, enabling three-dimensional stacking while maintaining process simplicity
Solution Approach 2:
The invention transitions from planar single-wafer processing to three-dimensional multi-layer assembly by introducing vertical stacking capability through multiple probes operating at different heights and angles, allowing mechanical structures to extend in the depth dimension while preserving manufacturing simplicity
2Ease of operation
If electrostatic/magnetic forces are used for manipulation, then manipulation capability is enhanced, but positioning accuracy deteriorates due to adhesion effects
Solution Approach 1:
The patent introduces a three-point mechanical grasping system using probes that contact the part at specific locations, serving as an intermediary between the manipulation system and the micro part. This mechanical approach eliminates electrostatic adhesion while maintaining dexterous manipulation capability through coordinated probe motion
Solution Approach 2:
The invention replaces electrostatic and magnetic field-based manipulation with a purely mechanical three-point grasping system. The probes make direct physical contact with the part at three strategically positioned points, providing controlled manipulation without the positioning errors caused by adhesion forces
3Ease of operation
If multiple probes with six degrees of freedom are used, then manipulation dexterity is improved, but system complexity increases
Solution Approach 1:
The system uses multiple probes that can each perform multiple functions: grasping in the first workspace, orientation in the second workspace, and placement in the third workspace. This multi-functionality reduces the need for specialized components for each operation, managing system complexity while maintaining high manipulation dexterity
Solution Approach 2:
The system incorporates vision systems that provide real-time feedback on part position and orientation, enabling the control system to coordinate the six degrees of freedom of multiple probes accurately. This feedback mechanism manages the complexity of controlling multiple probes by providing continuous spatial information
4Manufacturing precision
If micron and submicron tolerance placement is required, then assembly precision is improved, but susceptibility to positioning errors from electrostatic forces increases
Solution Approach 1:
The invention replaces field-based manipulation with direct mechanical contact through three-point grasping. The probes physically contact the part at three points, providing stable mechanical control that is not susceptible to electrostatic adhesion effects, thereby achieving micron and submicron placement accuracy
Solution Approach 2:
The system applies localized three-point contact at specific locations on the part (two points on one side, one point on the opposite side), creating localized mechanical control zones that prevent electrostatic adhesion while enabling precise positioning through distributed contact points
Data Source
AI summary
A microassembly method and system utilizing multiple probes. Multiple manipulation actuators can be utilized for maintaining/holding one or more probes and an assembly substrate. Multiple microscope cameras can be configured to provide three distinct workspace configurations. At the center of each manipulation actuator is a die stage, which supports the assembly substrate upon which parts are assembled. A glue dispenser can also provide glue to a part prior to placement.