Solid-State Microbattery Packaging Using Releasable Adhesive Tape
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Solution Overview
Problem
The batch processing and packaging of solid-state microbatteries are challenging due to difficulties in fabrication, singulation leading to edge defects, and testing, especially in achieving hermetic sealing and mass production.
Innovation Solution
The use of a releasable adhesive material and polymer sealing for improved handling, testing, and packaging, along with a laser release process for singulation and hermetic sealing, enables efficient packaging and testing of solid-state microbatteries, reducing edge defects and facilitating mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional batch processing and packaging methods are used for solid-state microbatteries, then mass production is attempted, but edge defects occur during singulation and hermetic sealing is difficult to achieve
Solution Approach 1:
The patent segments the microbattery array into individually packaged units by introducing a tape substrate with adhesive material that allows selective separation. Each microbattery can be singulated without causing edge defects, as the adhesive tape provides a clean separation interface that prevents mechanical damage during the cutting process.
Solution Approach 2:
The tape substrate with adhesive material acts as an intermediary between the microbattery array and the final packaged product. This intermediary layer enables controlled singulation and hermetic sealing without directly exposing the microbattery edges to cutting stresses, thereby reducing edge defects while maintaining batch processing efficiency.
2Reliability
If hermetic sealing is implemented for solid-state microbatteries, then protection and quality are improved, but packaging complexity and difficulty increase
Solution Approach 1:
The patent employs a hermetic coating layer deposited on the tape substrate and insulator cap layer to provide hermetic sealing. This thin-film approach achieves reliable protection against environmental contaminants without requiring complex mechanical sealing structures, thereby improving reliability while minimizing packaging complexity.
Solution Approach 2:
The packaging structure uses composite materials including adhesive material, hermetic coating layer, and insulator cap layer that work together to provide both structural support and hermetic sealing. This composite approach achieves reliable protection through material properties rather than complex structural designs, reducing overall packaging complexity.
3Productivity
If laser release process is used for singulation, then separation efficiency is improved, but laser cutting impact and potential damage increase
Solution Approach 1:
The adhesive layer serves as an intermediary that absorbs and dissipates laser energy during the release process. This intermediary layer protects the underlying microbattery components from direct laser exposure, reducing thermal damage and stress while maintaining high singulation speed through efficient laser-induced adhesion release.
4Productivity
If parallel testing is enabled through improved packaging, then testing efficiency is improved, but packaging precision and alignment requirements increase
Solution Approach 1:
The tape substrate with adhesive material serves multiple functions including mechanical support, alignment reference, and separation interface. This universal component enables parallel testing of multiple microbatteries simultaneously while maintaining precise alignment through its structured adhesive pattern, thereby increasing testing throughput without compromising alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality and protection of solid-state microbatteries by providing hermetic sealing, reducing the impact of laser cutting, and enabling parallel testing, thus improving the batch processing and packaging efficiency.
Implementation Method 1
separating the set of solid-state microbattery components via a laser release process that ablates and de-bonds an interface between the set of solid-state microbattery components and the tape substrate layer
Data Source
AI summary
Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.