Microbattery Solder Joint Assembly for Compact Integration
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Solution Overview
Problem
Existing microbattery manufacturing methods, particularly the monolithic approach, are constrained by high technological requirements and limited architecture and sizing options, making them costly and inflexible for integration with microelectronics, which affects performance and compatibility.
Innovation Solution
A method involving the assembly of thin films between two substrates, where the second electrode is formed through a solder joint connecting the substrates, allowing for a face-to-face assembly that optimizes volume and reduces surface area requirements, enabling flexible sizing and improved compatibility with microelectronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a monolithic approach is used to form a microbattery on the same substrate as integrated circuit components, then space is saved and miniaturization is promoted, but the technological efficiency requirements become very high and production volumes must be very high to amortize co-integration costs
Solution Approach 1:
The microbattery manufacturing process is divided into separate stages: first forming the active stack on a temporary substrate, then transferring it to the final substrate. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity while maintaining miniaturization benefits
Solution Approach 2:
The active stack is preliminarily formed on a temporary substrate before final integration with the integrated circuit substrate. This preliminary action allows the microbattery to be manufactured with optimized parameters independent of the final application requirements, reducing technological efficiency constraints
2Volume of moving object
If a monolithic approach is used to form a microbattery on the same substrate as integrated circuit components, then space is saved and miniaturization is promoted, but the sizing and architecture of the microbattery are imposed by co-integration requirements
Solution Approach 1:
By separating the microbattery manufacturing from the integrated circuit substrate until the final transfer step, the design of the active stack can be independently optimized for different sizing and architecture requirements without being constrained by co-integration rules
Solution Approach 2:
The temporary substrate approach allows parameters such as microbattery size, shape, and architecture to be freely adjusted during the manufacturing process to match specific application requirements, then transferred to the final substrate
3Volume of moving object
If thin films are assembled between two substrates with solder joint connection, then volume is optimized and surface area requirements are reduced, but additional assembly steps are required
Solution Approach 1:
The solder joint that connects the two substrates simultaneously serves dual functions: providing mechanical support for the thin film assembly and forming the second electrode of the microbattery. This merging of functions reduces the total number of manufacturing steps despite the face-to-face assembly approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in microbatteries with high electric performance, reduced noise and parasitic signals, and cost-effective manufacturing, enabling integration with various microcomponents and integrated circuits while allowing for diverse microbattery sizes and architectures.
Implementation Method 1
forming a second electrode, said step of forming the second electrode comprising the assembly of said first and second substrates by soldering the first metal film and the second current collector by means of at least one solder ball
Implementation Method 2
forming a stack of thin films on a first substrate comprising, in succession from the first substrate, a first current collector, a first electrode, an electrolyte
Implementation Method 3
forming a stack of thin films on a first substrate comprising, in succession from the first substrate, a first current collector, a first electrode, an electrolyte
Data Source
AI summary
A microbattery that includes, in succession starting from a first substrate: a first current collector, a first electrode, an electrolyte, a second electrode consisting of a solder joint, a second current collector and a second substrate. Additionally, a method for manufacturing a microbattery, which includes the following steps: forming a thin-film multilayer including, in succession from the first substrate, a first current collector, a first electrode, an electrolyte and a first metal film; forming a second current collector on a face of a second substrate; and forming a second electrode by soldering the first metal film and the second current collector together, said substrates being placed facing each other during assembly.