Microbolometer Planar Surface via Dielectric Vias
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Solution Overview
Problem
Existing microbolometers face challenges in depositing thermometric or thermoresistive materials on planar surfaces while ensuring reliable electric contact with the absorber or electrode, which can lead to low-frequency noise due to surface unevenness.
Innovation Solution
The solution involves depositing a dielectric layer on the absorber or electrode and forming conductive vias through this layer to create a planar surface for the thermometric or thermoresistive material, ensuring electric continuity without degrading performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thermometric or thermoresistive material is deposited directly on the absorber or electrode to ensure electric contact, then the electric connection is reliable, but the surface unevenness causes low-frequency noise
Solution Approach 1:
The patent introduces a dielectric layer as an intermediary between the absorber/electrode and the thermometric or thermoresistive material. This dielectric layer provides a planar surface that eliminates surface unevenness-induced noise while conductive vias through the dielectric layer maintain reliable electric contact. The intermediary layer thus resolves the contradiction by decoupling the requirements for direct contact (for reliability) and surface flatness (for noise reduction).
Solution Approach 2:
The patent transitions from a direct two-dimensional contact interface to a three-dimensional structure with conductive vias penetrating through the dielectric layer. This dimensional change allows electric contact to be established through vertical pathways (via holes) rather than requiring direct surface contact, thereby enabling both planar surface deposition and reliable electrical connection simultaneously.
2Object-generated harmful factors
If a dielectric layer is deposited on the absorber or electrode to create a planar surface, then the surface unevenness is reduced, but the electric contact may be degraded
Solution Approach 1:
The dielectric layer serves as a mediator that provides surface planarity while conductive vias embedded within it maintain electrical connectivity. The intermediary structure allows the system to benefit from both the noise-reducing planar surface and the reliable electric contact provided by the conductive pathways through the dielectric layer.
Solution Approach 2:
The structure combines dielectric material (for surface planarity and noise reduction) with conductive material (for electrical contact) in a composite configuration. The dielectric layer with embedded conductive vias creates a composite structure that simultaneously provides both electrical insulation for noise reduction and conductive pathways for reliable contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the deposition of thermometric or thermoresistive materials on planar surfaces, reducing low-frequency noise and improving the overall performance of the microbolometer by ensuring reliable thermal and electric exchanges.
Implementation Method 1
means for absorbing the thermal radiation and for converting said thermal radiation into heat
Implementation Method 2
thermometry means which, in the context of a microbolometric detector, use a resistive element having its resistance varying with temperature
Implementation Method 3
a dielectric layer deposited on said absorber or electrode and on said support layer
Implementation Method 4
at least two conductive vias formed through the dielectric layer in contact with said at least two electrodes
Data Source
AI summary
An infrared imaging microbolometer integrating a membrane assembled in suspension above a substrate by means of holding arms attached to anchoring nails is disclosed. The membrane includes a support layer crossing the upper end of the anchoring nails. It also includes an absorber or electrode deposited on the support layer and on the anchoring nails with a pattern forming at least two electrodes. It further includes a dielectric layer deposited on the absorber or electrode and on the support layer, at least two conductive vias formed through the dielectric layer in contact with the at least two electrodes, and a thermometric or thermoresistive material arranged on a planar surface formed at the level of the upper ends of the conductive vias.