Microbubble Cleaning Liquid for Semiconductor Wafer Wax Removal
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Solution Overview
Problem
Conventional cleaning methods for semiconductor wafers often result in undissolved wax being exfoliated as a solid, which can re-adhere and contaminate the wafer, leading to filter clogging.
Innovation Solution
A cleaning method using a liquid containing microbubbles, an alkaline component like ammonia, and a surfactant to uniformly dissolve and remove wax from the wafer surface without exfoliation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used to remove wax from wafer surface, then wax removal is achieved, but undissolved wax is exfoliated as solid particles causing re-contamination and filter clogging
Solution Approach 1:
The invention changes the physical state parameters of the cleaning liquid by introducing microbubbles, transforming it from a conventional liquid to a microbubble-containing cleaning medium. This parameter change enables complete wax dissolution without solid exfoliation, resolving the contradiction between effective wax removal and particle contamination prevention
Solution Approach 2:
The invention replaces conventional mechanical cleaning methods with a chemical-microbubble based cleaning mechanism. Instead of relying on mechanical action that causes wax exfoliation, the microbubble-containing cleaning liquid chemically dissolves wax completely, eliminating particle generation while maintaining cleaning effectiveness
2Productivity
If cleaning liquid is used to dissolve wax, then wax removal efficiency is improved, but filter clogging occurs due to solid wax particles
Solution Approach 1:
By changing the physical state of the cleaning liquid to contain microbubbles, the invention achieves complete wax dissolution in liquid form. This parameter change maintains high wax removal efficiency while preventing filter clogging, as dissolved wax does not precipitate as solid particles that would block filters
Solution Approach 2:
The microbubbles act as an intermediary medium that facilitates complete wax dissolution. The microbubble-containing cleaning liquid serves as a mediator between the wax and the cleaning process, enabling efficient wax removal while maintaining filter operation reliability by preventing solid particle formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures complete dissolution of wax, reducing the risk of re-contamination and filter clogging, and provides an efficient wax removal process in semiconductor fabrication.
Implementation Method 1
the cleaning liquid contains microbubbles
Implementation Method 2
a cleaning method using a liquid containing microbubbles, an alkaline component like ammonia, and a surfactant to uniformly dissolve and remove wax from the wafer surface without exfoliation
Implementation Method 3
cleaning using bases, etc. is carried out
Data Source
AI summary
A wax removal method uniformly removes wax adhering to a wafer surface and reduces the problems of re-adhesion of particles and filter clogging of a cleaning bath during cleaning. The method uses cleaning liquid which contains microbubbles.