Microbump Antenna Interconnects for Wireless Chip-to-Chip Data Links
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Solution Overview
Problem
Current chip-to-chip communication technologies face challenges in achieving high-speed, efficient, and cost-effective interconnects within multichip modules, particularly in 3D heterogeneous integration, due to limitations in data rate, scalability, and increased complexity and cost associated with silicon interposers and wired interconnects.
Innovation Solution
The implementation of wireless chip-to-chip (WC2C) communication using wideband microbump antennas and a broadcasting channel with low-loss transmission media, enabling point-to-point and multipoint connections with high throughput and low latency, while reducing the need for extensive routing and increasing data center interconnect capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wired interconnects and silicon interposers are used for chip-to-chip communication, then data transmission can be achieved, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent replaces wired mechanical interconnects with wireless electromagnetic communication. Microbump antennas are integrated directly onto chiplets, enabling data transmission through electromagnetic waves instead of physical wire bonds or traces. This substitution eliminates the need for complex routing layers and interposer structures while maintaining reliable communication between stacked chiplets in 3D heterogeneous integration.
2Adaptability or versatility
If silicon interposers are used to integrate multiple chiplets, then interconnect functionality is provided, but manufacturing cost increases
Solution Approach 1:
The patent extracts the interconnect functionality from the silicon interposer and integrates it directly into the chiplets themselves through embedded microbump antennas. Each chiplet becomes self-contained with its own wireless communication capability, eliminating the need for a separate, expensive silicon interposer substrate. This extraction reduces manufacturing complexity and cost while preserving the ability to integrate multiple chiplets in 3D configurations.
3Reliability
If traditional wired interconnects are used, then chip-to-chip communication is established, but data rate and throughput are limited
Solution Approach 1:
The patent changes the fundamental transmission parameter from wired electrical signals to wireless electromagnetic waves. This parameter change enables higher data rates and throughput because electromagnetic waves can carry more information and are not constrained by the physical bandwidth limitations of wire bonds and traces. The wireless channel provides scalable bandwidth that can accommodate increasing data throughput requirements in 3D chiplet architectures.
4Adaptability or versatility
If extensive routing is implemented for wired interconnects, then connectivity between chiplets is achieved, but latency increases
Solution Approach 1:
The patent transitions from 2D planar routing to 3D wireless spatial communication. Instead of routing signals through multiple layers of copper traces and wire bonds that add propagation delay, the microbump antennas transmit electromagnetic waves directly through the air gap between stacked chiplets. This dimensional change to wireless 3D space eliminates the time-consuming physical routing path while maintaining full connectivity between any pair of chiplets in the stack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
WC2C communication enhances data throughput, reduces latency, and improves system performance by allowing efficient multichip-to-multichip interconnections with flexible design and reduced manufacturing costs, overcoming limitations of traditional wired and silicon-based interconnects.
Implementation Method 1
wireless chip-to-chip (WC2C) communication using wideband microbump antennas
Implementation Method 2
broadcasting channel with low-loss transmission media
Data Source
AI summary
Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.