Micro-bump Layer for 3DIC Signal Integrity
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Solution Overview
Problem
Signal integrity is a challenge in 3DIC packaging due to the limitations of metal layers within the interposer for transmitting signals between dies, leading to interference and crosstalk.
Innovation Solution
The use of a micro-bump layer comprising micro-bumps and micro-bump lines for vertical and horizontal connections between dies and within the interposer, which provides lower resistance and lower wiring density, thereby improving signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal layers inside the interposer are used to transmit signals between dies, then the package structure is simple and easy to manufacture, but signal integrity deteriorates due to interference and crosstalk
Solution Approach 1:
The patent transitions from planar metal layer routing to three-dimensional micro-bump interconnections. Micro-bumps provide vertical and lateral signal paths that route signals around interfering conductors rather than through overlapping metal layers, reducing crosstalk while maintaining a compact package structure.
Solution Approach 2:
The micro-bump layer acts as an intermediary between dies and the interposer substrate. This intermediate connection layer provides dedicated signal paths that bypass the interfering metal layers within the interposer, improving signal integrity without requiring complete redesign of the interposer structure.
2Object-affected harmful factors
If metal layers inside the interposer are used for signal transmission, then the wiring density is high, but this causes increased interference and crosstalk
Solution Approach 1:
The patent segments the signal transmission function across multiple layers: micro-bumps provide vertical connections, micro-bump lines provide lateral connections, and the interposer substrate provides additional routing. This segmentation distributes the wiring function across different spatial domains, reducing the density of conductors in any single layer and thereby reducing interference.
3Reliability
If micro-bump layer is used instead of metal layers, then signal integrity improves with lower resistance and shorter paths, but the formation process becomes more complex
Solution Approach 1:
The patent combines multiple functions into the micro-bump structure: micro-bumps provide both mechanical support and electrical connection, while micro-bump lines integrated with the same process provide additional signal routing. This merging of functions achieves improved signal integrity without requiring completely separate manufacturing processes.
Data Source
AI summary
Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost.