Microcapsule Curable Composition for Fast Curing and Storage Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
One-pack curable compositions used in electronic device manufacturing face a trade-off between shortening curing time and maintaining stability during storage. Additionally, existing techniques require strong external forces to release the curing agent from microcapsules, which can decrease workability during assembly.
Innovation Solution
A curable composition comprising a liquid first agent and microcapsules dispersed within it, where each microcapsule has a coating film encapsulating a second liquid agent. The microcapsules have a strength of 15 N or less, allowing easy release of the second agent upon contact with the first agent, thereby initiating the curing reaction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a one-pack curable type curable composition is used to shorten curing time, then productivity is improved, but stability during storage deteriorates
Solution Approach 1:
The curable composition is segmented into two separate packs: Pack A containing the main curable composition and Pack B containing the curing agent in microcapsule form. This segmentation allows the composition to remain stable during storage while enabling rapid curing when the two packs are mixed. The microcapsules in Pack B can be applied before assembly and will release the curing agent upon contact with moisture from Pack A, achieving fast curing without compromising storage stability.
Solution Approach 2:
The microcapsules containing the curing agent can be applied to the bonding surface in advance before assembly occurs. This preliminary action allows the microcapsules to be positioned and secured beforehand, and the curing reaction will automatically initiate upon contact with moisture from the main curable composition during assembly, eliminating the need for post-assembly curing steps and reducing overall curing time.
2Productivity
If strong external force is applied to release the curing agent from microcapsules, then the curing reaction is initiated, but workability during assembly deteriorates
Solution Approach 1:
The patent replaces the mechanical force-based release mechanism with a moisture-triggered release mechanism. The microcapsules are designed to release the curing agent upon contact with moisture from the main curable composition or environmental humidity, eliminating the need for strong external mechanical forces. This substitution maintains ease of assembly operations while ensuring reliable initiation of the curing reaction through chemical/biological sensing rather than mechanical force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduction in curing time while maintaining stability during storage, and improves workability during assembly by enabling easy release of the curing agent with minimal external force, thus enhancing productivity.
Implementation Method 1
The curable composition is configured to be cured by contact between the first agent and the second agent
Data Source
AI summary
A curable composition is provided which includes a liquid first agent and microcapsules dispersed in the first agent. Each of the microcapsules includes a coating film and a second liquid agent encapsulated inside the coating film. A strength of each of the microcapsules is 15 N or less. The curable composition is configured to be cured by contact between the first agent and the second agent.