Microcapsule Hardener for Epoxy Resin with Infrared-Absorbing Shell
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Solution Overview
Problem
One-part epoxy resin compositions face challenges in achieving both high storage stability and rapid reaction rates, particularly in the field of electronic appliances, where integration density, connection reliability, and productivity are critical, and existing solutions often compromise on either stability or reaction speed.
Innovation Solution
A microcapsule-based hardener for epoxy resin is developed with a core formed using an amine adduct as the main component, where the hardener has a specific average particle size and a small-particle-size content, and the shell is designed with infrared-absorbing binding groups and urea bonds, ensuring optimal storage stability and reaction rapidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a one-part epoxy resin composition contains dicyandiamide as a latent hardener, then storage stability is improved, but hardening property deteriorates (high hardening temperature required)
Solution Approach 1:
The hardener is divided into multiple functional components: dicyandiamide provides storage stability, while cycloaliphatic amines and polybasic aromatic amines provide hardening activity. This segmentation allows each component to fulfill its specific function without compromising the other.
Solution Approach 2:
The patent uses a composite hardener system combining dicyandiamide with cycloaliphatic amines and polybasic aromatic amines. This composite approach creates a hardener that simultaneously achieves both storage stability (from dicyandiamide) and good hardening property (from the amine components).
2Temperature
If a curing accelerator is added to decrease hardening temperature, then hardening property is improved, but storage stability deteriorates (low temperature storage required)
Solution Approach 1:
The hardener is segmented into storage-stability-providing components (dicyandiamide) and hardening-activity-providing components (cycloaliphatic amines, polybasic aromatic amines). This segmentation eliminates the need for separate curing accelerators while maintaining both storage stability and hardening performance.
Solution Approach 2:
The composite hardener formulation integrates multiple amine types that work synergistically: dicyandiamide ensures storage stability while the cycloaliphatic and polybasic aromatic amines provide sufficient hardening activity without requiring external accelerators or low-temperature storage.
3Strength
If two-part epoxy resin composition is used, then hardening property is improved, but ease of operation deteriorates (separate storage and mixing required)
Solution Approach 1:
The patent merges the epoxy resin and hardener into a single integrated composition where the hardener is incorporated into the resin matrix. This combining eliminates the need for separate storage containers and mixing operations while maintaining excellent hardening properties through the designed hardener structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microcapsule-based hardener exhibits excellent storage stability and rapid reaction capabilities, enabling high integration density, improved connection reliability, and enhanced productivity in electronic applications.
Implementation Method 1
the shell (S) has, at least on the surface thereof, a binding group (x) capable of absorbing an infrared ray having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing an infrared ray having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing an infrared ray having a wave number of from 1730 to 1755 cm−1
Data Source
AI summary
Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.