Microchannel Chip Corner Roundness Control

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Solution Overview

Problem

The generation of bubbles in microchannels during the manufacturing of microchannel chips using molds formed by direct engraving, which results in rounded corners and incomplete sealing, leading to potential microspaces and bubble formation.

Innovation Solution

A microchannel chip design where the resin substrate's corners are chamfered to a roundness of R5 μm or less, with specific temperature and pressure conditions for mold and resin injection to prevent bubble formation, using a mold formed by direct engraving and a covering material to seal the channel grooves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a mold formed by direct engraving is used to manufacture the resin substrate, then manufacturing cost is reduced, but corner roundness increases causing bubbles to form in channels

Engineering Contradiction:

Improvemanufacturing costVSAvoidcorner roundness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by optimizing the injection molding process parameters (injection pressure, mold temperature, resin temperature) to achieve sharp corners (R5 μm or less) despite using a direct engraving mold. This resolves the contradiction by changing process parameters rather than the mold manufacturing method, maintaining low cost while improving precision.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies preliminary action by pre-heating the mold and resin to specific temperatures before injection, and controlling injection pressure, to ensure the resin fills the mold cavity properly and forms sharp corners. This preliminary preparation prevents corner rounding during the actual molding process.

Inventive Principle:

Principle #10Preliminary action

2Device complexity

If corner roundness is not controlled, then manufacturing process is simpler, but microspaces remain causing bubbles to be generated

Engineering Contradiction:

Improveprocess complexityVSAvoidbubble-free channel

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent changes process parameters (injection pressure of 90-120 MPa, mold temperature relative to load deflection temperature, resin temperature relative to glass transition temperature) to achieve proper resin filling and corner formation without adding complex processing steps, maintaining simplicity while ensuring reliability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces mechanical corner chamfering or polishing operations with optimized injection molding parameters to achieve sharp corners. This substitution maintains process simplicity while achieving the required corner precision to prevent bubbles.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If injection pressure is increased to improve filling, then corner sharpness improves, but manufacturing cost and energy consumption increase

Engineering Contradiction:

Improvecorner sharpnessVSAvoidinjection energy

Core Design Contradiction:

Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent optimizes injection pressure to a specific range (90-120 MPa) rather than using excessively high pressures, and combines it with optimized mold and resin temperatures to achieve proper filling and corner sharpness. This balanced parameter approach reduces energy consumption while maintaining precision.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents bubble generation in microchannels while maintaining low-cost manufacturing, ensuring effective sealing and reducing microspaces between the resin substrate and the covering material.

Implementation Method 1

the resin substrate is formed by injecting a molten resin into a cavity space formed in the mold

Methodology Applied

Scientific EffectInjection molding:

Implementation Method 2

the mold heated to a temperature of (T1−20° C.) or more and T1 or less

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a covering material joined to the resin substrate to cover the channel groove

Methodology Applied

Scientific EffectJoining:

Data Source

PatentUS20240390891A1Microchannel chip

Publication Date: 2024.11.28 SUMITOMO BAKELITE CO LTD

AI summary

A microchannel chip (1) includes a resin substrate (2) manufactured using a mold formed by direct engraving, and including a channel groove (21) on one surface of the resin substrate (2); and a covering material (3) joined to the resin substrate (2) to cover the channel groove (21). In the resin substrate (2), the roundness of a corner (2c) formed at a boundary between a joint surface (2a) to the covering material (3) and an inner surface (2b) defining the channel groove (21) is R5 μm or less.