Resin Microchannel Chip Bonding via Soft-Press
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Solution Overview
Problem
Conventional manufacturing methods for resin microchannel chips often result in insufficient initial joint strength and deformation of microchannels due to increased pressure during the joining process.
Innovation Solution
The method involves applying surface modification treatment to the joining surfaces of resin channel and lid substrates, followed by pressurization under heating using a fluid or elastic body with a durometer hardness of E20 or less, which effectively increases initial joint strength while minimizing microchannel deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If pressure at the time of pressing or rolling is increased to obtain sufficient joint strength, then joint strength is improved, but deformation of microchannels occurs
Solution Approach 1:
The patent introduces a silicone rubber sheet as an intermediary pressing member between the press machine and the resin substrates. This mediator distributes the pressing force uniformly across the substrate surfaces, preventing localized high stress that causes microchannel deformation while maintaining sufficient overall pressure for strong bonding joints.
Solution Approach 2:
The patent changes the physical parameters of the pressing system by using a compliant silicone rubber sheet with specific hardness (Shore A 20-40) instead of rigid pressing surfaces. This parameter change allows the pressing interface to adapt to substrate surface variations, distributing pressure evenly and preventing microchannel deformation while achieving adequate joint strength.
2Ease of manufacture
If conventional press machine or roll machine is used for joining, then manufacturing process is simple, but initial joint strength after manufacture is insufficient
Solution Approach 1:
The silicone rubber sheet acts as a mediator that enhances the bonding process by conforming to the substrate surfaces and ensuring uniform contact. This simple addition to the existing press machine or roll machine setup significantly improves initial joint strength without complicating the manufacturing process.
Solution Approach 2:
The patent employs a flexible silicone rubber sheet as the pressing interface instead of rigid surfaces. This flexible film adapts to the substrate topography, ensuring complete surface contact and uniform pressure distribution, which dramatically improves initial joint strength while maintaining process simplicity.
3Strength
If surface modification treatment is applied on joining surfaces, then joint strength is improved, but manufacturing process complexity increases
Solution Approach 1:
The silicone rubber sheet serves as a physical intermediary that enhances bonding through mechanical conformability and pressure distribution. This approach provides joint strength improvement through a simple mechanical means rather than complex chemical surface modifications, thereby avoiding increased manufacturing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of resin microchannel chips with enhanced initial joint strength and limited microchannel deformation, maintaining durability and optical stability.
Implementation Method 1
resin microchannel chips are manufactured by thermo-compression bonding of a resin substrate having microchannels formed thereon and a resin lid substrate
Implementation Method 2
the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body
Implementation Method 3
in the step (A), the surface modification treatment is applied using a silane coupling agent
Data Source
Figure 1A~1B
AI summary
Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.