Microchannel Cooling Module for Uniform Chipset Heat Dissipation
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Solution Overview
Problem
Existing thermal management systems for circuit modules face challenges in efficiently dissipating waste heat due to low heat transfer coefficients and high capital and operating costs associated with multiple coolant distribution units, leading to uneven heat dissipation and potential chip damage.
Innovation Solution
A cooling module with a first cooling component featuring microchannel blocks and a second cooling component with distribution conduits, which bifurcates coolant flow to ensure high heat transfer coefficients and uniform heat dissipation across multiple chipsets, reducing the need for multiple coolant distribution units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple coolant distribution units are used to dissipate waste heat, then heat dissipation capacity is improved, but capital and operating costs increase
Solution Approach 1:
The cooling component is segmented into multiple independent cooling channels, each with its own inlet and outlet ports. This allows the system to handle multiple chipsets simultaneously through a single cooling component, eliminating the need for multiple separate coolant distribution units while maintaining high heat dissipation capacity.
Solution Approach 2:
The cooling component is designed with universal functionality to cool multiple different chipsets through a single unit. The multiple cooling channels and distributed inlet/outlet ports enable one cooling component to perform the function of multiple separate units, reducing both capital and operating costs.
2Temperature
If coolant flow rate is increased to improve heat dissipation, then heat transfer coefficient is improved, but operating costs increase
Solution Approach 1:
The coolant flow is segmented into multiple independent channels within the cooling component. This segmentation allows the system to achieve high heat transfer coefficients through distributed flow paths without requiring a high total volumetric flow rate, as the heat dissipation is distributed across multiple channels rather than concentrated in a single high-flow path.
3Device complexity
If conventional cooling methods are used, then system simplicity is maintained, but heat dissipation uniformity deteriorates
Solution Approach 1:
The cooling component incorporates multiple inlet and outlet ports distributed at different locations to provide localized cooling where heat is generated. This local quality approach ensures uniform heat dissipation across different chipsets by directing coolant flow to specific high-heat areas, maintaining system simplicity while achieving uniform thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling module effectively dissipates waste heat uniformly across all chipsets, maintaining thermal margins and reducing capital and operating costs by operating at a lower volumetric flow rate, thus protecting chips and enhancing system efficiency.
Implementation Method 1
Each distribution conduit directs a flow of coolant from the inlet port to the outlet port through the one or more microchannel blocks to absorb the waste heat transferred to the one or more microchannel blocks from at least one chipset of the plurality of chipsets
Data Source
AI summary
Example implementations relate to a cooling module, a circuit assembly having one or more circuit modules and the cooling module, and a method of forming the cooling module. The cooling module includes a first cooling component and a second cooling component disposed on the first cooling component. The first cooling component includes a plurality of microchannel blocks thermally coupled to a plurality of chipsets of the circuit module. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits fluidically coupled to the inlet port and outlet port. Each distribution conduit is disposed on one or more microchannel blocks of the plurality of microchannel blocks and directs coolant from the inlet port to the outlet port through the one or more microchannel blocks to absorb waste heat transferred to the one or more microchannel blocks from at least chipset of the plurality of chipsets.