Microchannel Fin Array Cooling for Blockage-Resistant Heat Transfer
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Solution Overview
Problem
Microelectronic packages face thermal challenges due to small form factors and increasing power density, leading to issues with heat dissipation and device failure from blockages in cooling solutions, particularly in microchannel fin arrays with narrow widths where particles can cause complete channel blockage.
Innovation Solution
The implementation of blockage-resistant microchannel fin array structures with alternating rows of fins and channel regions that allow for particle filtering and alternate fluid flow routes, enhancing heat transfer efficiency and preventing device thermal failure by redirecting fluid flow around blockages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If microchannel fin arrays with narrow widths are used to increase heat transfer efficiency, then the heat transfer coefficient is improved, but particles can cause complete channel blockage
Solution Approach 1:
The microchannel fin array is divided into multiple segments with alternating rows of fins and channel regions. This segmentation creates multiple independent fluid flow paths, so that blockage in one channel does not affect the entire cooling system. The fins are arranged in alternating rows with channel regions between them, creating a segmented structure that provides redundancy against particle blockage while maintaining narrow channel widths for efficient heat transfer.
2Reliability
If alternating rows of fins and channel regions are implemented to provide alternate fluid flow routes, then blockage resistance is improved, but the device complexity increases
Solution Approach 1:
The cooling solution merges the heat dissipation function with the blockage resistance function into a single integrated microchannel fin array structure. The alternating rows of fins and channel regions serve dual purposes: maintaining narrow widths for efficient heat transfer while simultaneously providing alternate flow paths for blockage resistance. This merging eliminates the need for separate filtering components or complex flow redistribution systems.
Solution Approach 2:
The microchannel fin array structure is designed to perform multiple functions simultaneously: heat transfer, fluid flow distribution, and blockage resistance. The alternating rows of fins and channel regions create a universal structure that handles both cooling efficiency and reliability against particle blockage within the same component, reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the heat transfer coefficient and prevents local hotspots by allowing fluid to flow around blockages, maintaining efficient cooling even in densely packed microchannel arrays with narrow widths, thus reducing the risk of thermal failure in microelectronic devices.
Implementation Method 1
The cooling solution is thermally coupled to the device and includes microchannel fin array structures that allow fluid to flow around blockages, enhancing heat transfer efficiency
Implementation Method 2
A thermal interface material may be between a second side of the device and the cooling solution
Data Source
AI summary
Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.