Microchannel Chip Module Cooling for CTE Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling solutions for electronic modules face challenges due to thermal resistance and heat transfer inefficiencies, particularly in high-power density modules with mismatched materials leading to thermal stress and potential device failure.
Innovation Solution
The integration of a microchannel cooler with a glass manifold and CTE-matched semiconductor chips, along with a first RDL or organic interposer that is CTE mismatched, reduces thermal resistance and improves heat dissipation, enhancing reliability and reducing leakage currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a microchannel cooler is integrated with functional semiconductor chips to improve heat dissipation, then thermal resistance is reduced and operating temperature is lowered, but CTE mismatch between materials causes thermal stress and potential device failure
Solution Approach 1:
A CTE-matched microchannel chip is introduced as an intermediary component between the functional semiconductor chips and the cooling system. This microchannel chip has a coefficient of thermal expansion that matches the semiconductor chips, serving as a thermal and mechanical bridge that enables effective heat dissipation while preventing CTE-mismatch-induced thermal stress and device failure
Solution Approach 2:
The cooling system employs a composite structure consisting of a glass manifold and a microchannel chip made of CTE-matched material. This composite design combines the thermal management capabilities of the microchannel structure with the thermal expansion properties that match the semiconductor chips, achieving both effective cooling and stress mitigation
2Reliability
If CTE-matched materials are used for all components to prevent thermal stress, then device reliability is improved, but heat transfer efficiency is reduced due to material property constraints
Solution Approach 1:
Different components of the cooling system have different material properties optimized for their specific functions: the microchannel chip is made of CTE-matched material to prevent thermal stress at the semiconductor interface, while the glass manifold can be made of materials optimized for heat transfer efficiency. This local differentiation of material properties allows the system to achieve both reliability and thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively lowers semiconductor chip operating temperatures, improves reliability, and maintains structural integrity despite CTE mismatches, ensuring reliable operation and reduced thermal stress.
Implementation Method 1
a microchannel cooler having a glass manifold contacting a first side of a microchannel chip... reduces semiconductor chip operating temperature
Implementation Method 2
glass manifold contacting a first side of a microchannel chip... provides fluid distribution to the microchannel chip
Implementation Method 3
each functional semiconductor chip of the plurality of functional semiconductor chips is coefficient of thermal expansion (CTE) matched to the microchannel cooler
Data Source
AI summary
An electronic module is provided that includes a microchannel cooler having a glass manifold contacting a first side of a microchannel chip, a plurality of functional semiconductor chips located face up on a second side of the microchannel chip. Each semiconductor chip of the plurality of functional semiconductor chips is coefficient of thermal expansion (CTE) matched, and a first redistribution layer (RDL) containing structure or organic interposer is located above and in electrical contact with the plurality of functional semiconductor chips. In either case, the first RDL containing structure and the organic imposer are not CTE matched to the functional semiconductor chips.