Modular Microchannel Cooling Layouts for IC Hotspot Control
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Solution Overview
Problem
Current microfluidic cooling devices for semiconductor packages require redesign and re-fabrication with changes in integrated circuit layouts or power ratings, leading to increased manufacturing complexity and cost, as they are not adaptable to varying thermal management needs of different IC devices.
Innovation Solution
A customizable microfluidic cooling device with a template substrate and supplemental material deposited via HTAM processes, allowing for on-demand customization of microchannel configurations to optimize thermal management for specific IC devices, including the use of plugs and baffles to direct coolant flow over hotspots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If microfluidic cooling devices are customized for each IC device, then cooling efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent pre-fabricates template substrates with standardized microchannel patterns before final customization. These templates are prepared in advance with generic cooling channel layouts that can be subsequently modified through HTAM deposition to match specific IC device thermal requirements, thereby reducing the complexity of complete custom fabrication while maintaining cooling efficiency.
Solution Approach 2:
The cooling device is divided into modular components: a reusable template substrate containing standardized microchannels and a customizable HTAM-deposited layer that is added later to match specific IC thermal profiles. This segmentation allows the template to be manufactured once and reused across multiple IC devices, reducing manufacturing complexity while enabling customization for optimal cooling efficiency.
2Temperature
If microfluidic cooling devices are redesigned for changes in IC layouts or power ratings, then thermal management performance is improved, but manufacturing time and cost increase
Solution Approach 1:
Template substrates with standardized microchannel configurations are fabricated in advance and stored for future use. When IC device layouts or power ratings change, the existing templates can be rapidly reconfigured using HTAM deposition techniques to create customized cooling patterns, avoiding the need to redesign and re-fabricate entire microfluidic devices from scratch, thus reducing manufacturing time while maintaining thermal management performance.
Solution Approach 2:
The invention enables rapid adaptation to changing IC thermal requirements by modifying parameters such as microchannel geometry, material composition, and flow path configuration through HTAM deposition processes. These parameter changes can be implemented on existing template substrates without complete redesign, allowing quick response to changes in IC layouts or power ratings while maintaining high thermal management performance.
3Ease of manufacture
If generic template substrates are used, then manufacturing complexity is reduced, but adaptability to specific IC thermal requirements decreases
Solution Approach 1:
The cooling device combines a generic template substrate made from standard materials with a customized HTAM-deposited layer that provides specific thermal management properties. This composite structure integrates the manufacturing simplicity of generic templates with the adaptability of customized thermal patterns, allowing the final device to meet specific IC thermal requirements while benefiting from simplified template fabrication processes.
Solution Approach 2:
The HTAM deposition process acts as an intermediary between the generic template substrate and the specific IC thermal requirements. This intermediate step allows the standardized template to be transformed into a customized cooling device that matches particular IC layouts or power ratings, thereby bridging the gap between manufacturing simplicity and thermal adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient thermal management by concentrating coolant flow over hotspots, reducing thermal gradients and manufacturing complexity, while allowing for rapid production of tailored thermal solutions that match the thermal requirements of various IC devices, thereby enhancing cooling efficiency and reducing costs.
Implementation Method 1
a microfluidic device, comprising a channel within a first material to thermally couple with an IC die
Implementation Method 2
Microfluidic channels have been integrated into a variety of thermal solutions to enhance cooling capability
Implementation Method 3
A customizable microfluidic cooling device with a template substrate and supplemental material deposited via HTAM processes
Data Source
AI summary
A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.