Microchannel Cooling in High-Density IC Packages
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Solution Overview
Problem
High-density semiconductor IC chip packages face challenges in effective heat removal due to increased power density and thermal expansion issues, which can lead to physical damage and reliability concerns, especially with thin silicon carriers used in system-on-a-package designs.
Innovation Solution
Integration of microchannel cooling modules within high-density electronic modules, where high-performance IC chips are directly bonded to a cooling module using thermally conductive materials, and conductive vias are formed through the cooling module to provide both electrical and thermal paths, enhancing structural integrity and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple IC chips are densely packed together to increase integration density, then the quantity of chips per package is improved, but heat density and thermal management difficulties worsen
Solution Approach 1:
The patent transitions from planar 2D chip arrangement to 3D stacked configuration with intermediate carrier substrates. Multiple chip layers are vertically stacked and interconnected through through-vias in the carrier substrate, enabling higher integration density while distributing heat sources across multiple vertical levels to improve thermal management.
Solution Approach 2:
An intermediate carrier substrate is introduced as a mediator between multiple IC chip layers. This carrier substrate provides mechanical support, electrical interconnection through through-vias, and thermal management pathways, enabling dense chip stacking while maintaining structural integrity and heat dissipation capability.
2Use of energy by moving object
If silicon carrier thickness is reduced to minimize inductance and improve performance, then electrical performance is improved, but mechanical strength and structural integrity worsen
Solution Approach 1:
The patent employs a composite structure combining thin silicon carrier substrate with ceramic coating layers. The thin silicon layer ( minimized thickness) provides low inductance electrical interconnects, while the ceramic coating layers provide mechanical strength, thermal stability, and environmental protection, creating a composite material system that achieves both electrical performance and structural integrity.
3Volume of moving object
If chip package size is reduced to improve compactness, then volume and portability are improved, but heat removal capability worsens
Solution Approach 1:
The patent utilizes 3D vertical stacking to achieve high integration density within a compact footprint. Multiple IC chip layers are stacked vertically with intermediate carrier substrates, enabling the package volume to be minimized while maintaining effective heat removal pathways through the vertical architecture and thermal vias in the carrier substrate.
4Quantity of substance
If through vias are made smaller to increase density, then electrical interconnect density is improved, but manufacturing difficulty and reliability worsen
Solution Approach 1:
The patent optimizes the dimensional parameters of through vias, including diameter, length, and spacing, to achieve an optimal balance between interconnect density and manufacturability. The via dimensions are carefully controlled within specific ranges that enable successful formation and filling processes while maximizing the number of interconnects per unit area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively extracts heat from high-power IC chips, reduces mechanical stresses due to thermal expansion, and increases the structural integrity of the electronic assembly, enabling reliable operation of densely packed high-performance IC chips.
Implementation Method 1
high-performance IC chips bonded directly to the cooling module... thermally conductive materials... effectively extracts heat from high-power IC chips
Implementation Method 2
microchannel cooling modules... coolant flowing through channels... effectively extracts heat from high-power IC chips
Implementation Method 3
bonded directly to the cooling module using a solder, metal layer, silver epoxy, filled polymer, or other rigid thermally conductive bonding material
Data Source
AI summary
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.