Microchannel Chip Cover Resin for Adhesive-Free Gap Control
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Solution Overview
Problem
Conventional microchannel chips face issues with adhesive bonding methods that can lead to adhesive leaching and visibility problems, while adhesive-free methods may result in slight gaps or excessive deformation due to inappropriate resin material properties.
Innovation Solution
The microchannel chip design incorporates a cover member made from a resin material with a reduced modulus of 1.68 MPa to 44.3 MPa or a hardness of 0.12 MPa to 1.94 MPa, allowing it to conform to surface irregularities without adhesives, ensuring firm bonding and preventing gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonding method is used to bond cover member to substrate, then bonding strength is improved, but adhesive leaching and visibility problems occur
Solution Approach 1:
The invention removes the adhesive layer from the bonding structure, eliminating the source of adhesive leaching and visibility problems. The cover member is bonded directly to the substrate through surface contact without any intermediate adhesive material.
Solution Approach 2:
The invention introduces a partition layer as an intermediary structure between the substrate and cover member. This partition layer with controlled surface irregularities serves as the bonding interface, replacing the need for adhesive while maintaining bonding strength.
2Object-generated harmful factors
If adhesive-free bonding method is used to bond cover member to substrate, then adhesive leaching is eliminated, but slight gaps or excessive deformation occur
Solution Approach 1:
The invention changes the surface parameters of the partition layer by creating controlled surface irregularities with specific height and width dimensions. These parameter changes allow the cover member to conform to the surface without excessive deformation while eliminating gaps, achieving precise flow channel dimensions without adhesive.
Solution Approach 2:
The invention applies local surface modification to the partition layer, creating localized surface irregularities only at the bonding interface. The bulk material properties remain unchanged, allowing the cover member to conform locally to the surface irregularities while maintaining overall structural integrity and dimensional precision.
3Ease of manufacture
If resin material with inappropriate properties is used for cover member, then ease of manufacture is improved, but gaps or deformation occur
Solution Approach 1:
The invention specifies particular ranges for the reduced modulus (1.68-44.3 MPa) and hardness (0.12-1.94 MPa) of the resin material. These parameter specifications ensure the cover member is soft enough to conform to surface irregularities while maintaining sufficient structural integrity, achieving both ease of manufacture and bonding reliability.
Data Source
AI summary
A microchannel chip including a substrate, a partition layer formed on the substrate and defining a flow channel, and a cover member placed on the surface of the partition layer opposite to the surface in contact with the substrate. The cover member is formed from a resin material, and the resin material has a reduced modulus of 1.68 MPa or more and 44.3 MPa or less as measured by nanoindentation.