Microchannel Die Interconnections for Accurate Flexible Circuit Registration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing technologies face challenges in accurately and reliably registering solid semiconductor dies with printed traces on moving webs in flexible hybrid electronics manufacturing.
Innovation Solution
The development of an electronic device featuring a flexible substrate with an adhesive surface, microchannels, and through holes, where solid circuit dies are adhesively bonded such that their contact pads overlap the through holes, and a conductive particle-containing liquid is used to form electrically conductive channel traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solid semiconductor dies are registered with printed traces on moving webs using existing alignment mechanisms, then manufacturing process can be maintained, but alignment accuracy and reliability deteriorate due to incompatibility with web-based processes
Solution Approach 1:
The patent introduces microchannels and through-holes as intermediary alignment features that bridge the solid circuit die and the flexible substrate. These intermediaries provide precise mechanical registration points that are compatible with both wafer-based die and web-based printing processes, resolving the incompatibility between existing alignment mechanisms and web-based manufacturing
Solution Approach 2:
The patent segments the alignment function into distinct physical features (microchannels and through-holes) that can be independently formed on the flexible substrate. This segmentation allows the alignment mechanism to be decoupled from the moving web system, providing stable reference points that maintain precision during web-based manufacturing processes
2Reliability
If conventional rigid interconnection methods are used on flexible substrates, then electrical connection is achieved, but flexibility and form-factor adaptability are lost
Solution Approach 1:
The patent uses the flexible substrate itself as the interconnection medium, with conductive material deposited within microchannels and through-holes. This approach maintains the flexibility and form-factor adaptability of thin films while providing reliable electrical connections, as the conductive paths are integrated within the flexible substrate structure rather than using rigid external connectors
Solution Approach 2:
The patent nests the conductive interconnection paths within the flexible substrate by forming microchannels and through-holes that contain conductive material. This nested structure allows the electrical interconnection to be embedded within the flexible substrate itself, maintaining both reliability of connection and flexibility of the overall device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of electrically conductive traces on flexible substrates, effectively connecting circuit components of multi-layered circuits, including solid circuit dies, with high accuracy and reliability.
Implementation Method 1
providing a conductive particle-containing liquid in the pattern of microchannels and the one or more through holes to contact the one or more contact pads
Data Source
AI summary
A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.