Microchannel Heat Conductor Structure for Better Dissipation
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Solution Overview
Problem
Conventional heat conducting devices in electronic devices, such as notebook computers, have inadequate heat conduction efficiency, which hampers the improvement of heat dissipation performance.
Innovation Solution
A heat conducting device with a main body featuring an enclosable inner cavity and an uneven surface with height differences, including microchannels, to guide a medium for enhanced heat transfer, utilizing capillary forces to improve heat storage and flow efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat conducting devices are used, then the structure is simple, but the heat conduction efficiency is insufficient
Solution Approach 1:
The inner cavity surface is segmented into multiple parts with different heights, creating a stepped structure. This segmentation allows the heat conducting device to combine the advantages of both large-area heat storage (in lower regions) and efficient heat transfer (in higher regions with microchannels), thereby resolving the contradiction between structural simplicity and heat conduction efficiency.
Solution Approach 2:
Different regions of the inner cavity surface are given different local qualities: lower parts have larger heat storage capacity while upper parts have enhanced heat transfer capability through microchannels. This local differentiation allows each region to optimize its function, improving overall heat conduction efficiency without significantly complicating the manufacturing process.
2Productivity
If the inner cavity surface is made uneven with microchannels, then heat conduction efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The invention introduces height difference as an additional dimension to the inner cavity surface structure. By creating a stepped surface with multiple height levels rather than relying solely on two-dimensional microchannel patterns, the design achieves enhanced heat conduction while maintaining manufacturing feasibility through a more straightforward three-dimensional form.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves heat conduction by combining the fluidity of grooves with the heat storage capacity of capillary structures, resulting in more efficient heat dissipation in electronic devices.
Implementation Method 1
utilizing capillary forces to improve heat storage and flow efficiency
Implementation Method 2
heat conducting device to transfer the heat generated inside the electronic device to the outside of the electronic device
Data Source
AI summary
The present disclosure provides a heat conducting device. The heat conducting device includes a main body, the main body including an enclosable inner cavity, the inner cavity being configured to receive a medium and accommodate the medium to carry heat to flow in the inner cavity. A surface enclosing the inner cavity is an uneven surface with a height difference, a plurality of parts of the uneven surface having the height difference, and the plurality of parts having the height difference including a plurality of microchannels for guiding the medium.