Temperature sensor fixation on microchannel heat exchanger
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Solution Overview
Problem
Microchannel heat exchangers lack a standardized mechanism for securely and consistently placing temperature sensors, leading to inconsistent temperature measurements due to arbitrary sensor placement and poor thermal contact, which is critical for control purposes in refrigeration systems.
Innovation Solution
A support assembly that securely positions the temperature sensor within the fin package of a microchannel heat exchanger, ensuring consistent placement and thermal contact, comprising a support block and securement device that allows for precise alignment and fixation of the sensor between microchannel tubes, enabling accurate temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If no standardized mechanism is provided for sensor placement, then the heat exchanger structure remains simple, but temperature measurements become inconsistent due to arbitrary sensor placement
Solution Approach 1:
The patent incorporates a sensor housing and mounting features directly into the heat exchanger structure during manufacturing. The sensor housing is formed as an integral part of the heat exchanger body, with pre-defined mounting locations and alignment features that guide sensor placement before the heat exchanger is assembled or installed.
Solution Approach 2:
The patent introduces a sensor housing as an intermediary component that mediates between the sensor and the heat exchanger structure. The housing provides a standardized interface with features such as recesses, alignment pins, or threaded connections that ensure consistent sensor positioning while maintaining a relatively simple overall structure.
2Measurement precision
If the sensor is positioned optimally for accurate measurement, then measurement precision improves, but the heat exchanger must be manufactured around the sensor making it difficult to retrofit
Solution Approach 1:
The patent separates the sensor mounting function from the main heat exchanger body by using a modular sensor housing or adapter assembly. This segmented approach allows the sensor to be mounted at optimal locations while keeping the heat exchanger structure itself unchanged, enabling retrofitting of existing heat exchangers with standardized mounting brackets or adapters.
Solution Approach 2:
The patent designs universal mounting features such as standardized threaded holes, clamp positions, or magnetic mounting surfaces that can accommodate different sensor types and configurations. These universal features are incorporated into the heat exchanger structure to allow optimal sensor placement while maintaining the ability to retrofit different sensor solutions.
3Measurement precision
If the sensor placement location varies among heat exchangers, then installation flexibility is maintained, but temperature measurements become inconsistent
Solution Approach 1:
The patent employs asymmetric sensor housing designs or non-uniform mounting feature distributions that provide standardized, consistent sensor placement locations. The asymmetric features such as keyed mounting positions or orientation-specific alignment pins ensure that sensors are always installed in the same optimal location relative to the heat exchanger geometry, eliminating placement variation while maintaining ease of installation through clear alignment guidance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes temperature variation and ensures consistent, accurate temperature measurements, enhancing control capabilities in refrigeration systems by providing a stable and robust mechanism for sensor placement, facilitating easy installation and potential retrofitting of microchannel heat exchangers.
Implementation Method 1
The support block is configured to provide thermal contact between the fin package and the temperature sensor
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
A microchannel heat exchanger 1 and a method of assembling a microchannel heat exchanger are provided. The microchannel heat exchanger 1 comprises: a plurality of fins and a plurality of microchannel tubes arranged in a fin package 4; a temperature sensor 6 arranged to detect a temperature of the fin package 4; a support block 8 disposed between adjacent microchannel tubes in a predetermined position relative to the fin package 4 and comprising an opening 24 arranged to house a thermosensitive element 20 of the temperature sensor 6, the support block being configured to provide thermal contact between the fin package 4 and the thermosensitive element 20 of the temperature sensor 6; and a securement device 10 fastened to the fin package 4, wherein the securement device 10 is configured to secure the thermosensitive element 20 of the temperature sensor 6 in the support block 8.