Microchannel Heat Sink Thermal Bonding to Prevent Channel Deformation
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Solution Overview
Problem
Conventional microchannel heat sinks face issues with interlayer connection reliability, deformation, and leakage due to brazing and diffusion welding processes, which affect the heat dissipation efficiency of high power density chips.
Innovation Solution
A method involving thermal bonding with upper and lower cover plates processed to match the microchannel structure, aligned and stacked under pressure in a reducing atmosphere, eliminating the need for adhesives and reducing deformation, thereby enhancing bonding strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing process is used to join plates, then bonding strength is improved, but brazing filler flows into channels causing blockage and galvanic corrosion reducing reliability
Solution Approach 1:
The patent removes the brazing filler material from the joining process entirely, extracting the harmful element that causes channel blockage and galvanic corrosion while maintaining plate bonding through alternative mechanisms
Solution Approach 2:
The patent introduces a diffusion barrier layer as an intermediary between plates during diffusion bonding, preventing material contamination while enabling strong bonding without requiring brazing filler
2Strength
If diffusion welding process is used to achieve stronger bonding, then bonding strength is improved, but high pressure causes channel deformation in soft metal materials
Solution Approach 1:
The patent performs preliminary actions by creating a diffusion barrier layer and preparing plate surfaces before diffusion bonding, enabling bonding at reduced pressures that prevent channel deformation
Solution Approach 2:
The patent modifies process parameters by conducting diffusion bonding at lower pressures compared to conventional diffusion welding, changing the pressure parameter to prevent channel deformation while achieving sufficient bonding strength
3Shape
If insufficient pressure is applied during diffusion welding, then channel deformation is reduced, but bonding strength between plates becomes weak causing leakage
Solution Approach 1:
The diffusion barrier layer acts as a mediator that enables effective bonding at lower pressures by preventing material interdiffusion and contamination, ensuring leakage resistance without requiring high pressure that would deform channels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the bonding strength and reliability of microchannel heat sinks by directly applying pressure without adhesives, reducing deformation and leakage, and maintaining high heat dissipation efficiency.
Implementation Method 1
placing the upper cover plate, the each of the plates, and the lower cover plate that are aligned and stacked in a reducing atmosphere, and heating the upper cover plate, the each of the plates, and the lower cover plate that are aligned and stacked, and performing heat preservation
Implementation Method 2
applying a pressure on the upper cover plate and/or the lower cover plate
Data Source
Figure 1
Figure 2~3
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AI summary
The apresnt application adopts the thermal bonding process to process the microchannel heat sink. By placing the upper cover plate and the lower cover plate on the plates of the microchannel heat sink, the pressure is directly applied, and there is no need to add other adhesives. It can avoid the problems of blockage, galvanic corrosion etc. inside the channel caused by the brazing process, and improve the reliability of the microchannel heat sink product. Before welding, the upper cover plate and the lower cover plate are processed according to the microchannel structure to form a hollow structure, and then aligned and stacked with the microchannel heat sink, and then subjected to pressure welding, which not only accurately and effectively applies the pressure on the walls of the microchannel, but also can greatly relieve the pressure on the microchannel heat sink during the pressure welding process, and reduce the deformation of the cooling liquid channel portion of the microchannel heat sink. Compared with the conventional diffusion welding process, under the same conditions, this process can apply greater pressure to the microchannel heat sink, improve the bonding force between the plates of the microchannel heat sink and improve product stability.