Microchannel Lid Cooling Solution for High Power Devices
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Solution Overview
Problem
Aggressive cooling demands for high power packaged microelectronic devices are not effectively met by traditional fin and fan structures, which become large and inefficient, necessitating the use of liquid cooling in data centers and servers.
Innovation Solution
A package structure with a cooling solution that eliminates the thermal interface material (TIM) between the cooling solution and a lid, using a solder with high thermal conductivity to bond a lid with microchannels directly to the cooling solution, enabling efficient liquid and air cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional fin and fan cooling structures are used for high power packaged microelectronic devices, then the cooling coverage area is increased, but the structural complexity and size become prohibitively large
Solution Approach 1:
The patent merges the cooling solution and lid into a single integrated structure, eliminating the need for separate TIM layers and reducing overall structural complexity while maintaining effective cooling coverage area
2Power
If traditional fin and fan cooling structures are used, then cooling capacity is increased, but thermal resistance increases reducing cooling efficiency
Solution Approach 1:
By integrating the cooling solution directly with the lid structure, the patent eliminates thermal interface materials that create thermal resistance, thereby improving thermal conductivity and cooling efficiency while maintaining high cooling capacity
3Reliability
If liquid cooling structures are used in data centers, then cooling efficiency for high wattage devices is improved, but device complexity and pumping requirements increase
Solution Approach 1:
The patent combines liquid cooling channels directly into the lid structure, enabling efficient heat removal from high wattage devices while integrating the cooling function into the existing package structure, thereby reducing the need for external pumping infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal resistance and maintains structural integrity, achieving superior thermal performance for high power devices without the need for TIM, enhancing reliability and efficiency in cooling high-wattage systems.
Implementation Method 1
using a solder with high thermal conductivity to bond a lid with microchannels directly to the cooling solution
Implementation Method 2
a cooling solution...wherein the second surface is disposed on a backside of the die
Implementation Method 3
a lid comprising an outer surface and an inner surface, wherein the lid includes a plurality of fins disposed on the inner surface
Data Source
AI summary
Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.