Micro-Channel Package Structure for IC Heat Dissipation
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Solution Overview
Problem
The semiconductor industry faces challenges in effectively dissipating heat generated by densely integrated electronic components, necessitating improved packaging techniques to manage increasing heat loads as devices shrink in size.
Innovation Solution
A heat dissipation structure with micro-channels is integrated into the package, allowing a cooling fluid to flow through and dissipate heat generated by integrated circuit dies, enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integration density of electronic components is increased, then productivity and device functionality are improved, but heat generation increases and thermal management becomes more difficult
Solution Approach 1:
The heat dissipation structure is segmented into multiple micro-channels distributed across the package, allowing heat to be dissipated through multiple pathways simultaneously. This segmentation enables effective thermal management even as component integration density increases and heat generation rises.
Solution Approach 2:
The invention transitions from conventional two-dimensional heat dissipation at the die level to three-dimensional heat dissipation by incorporating micro-channels that extend vertically through the package structure. This dimensional change allows heat to be conducted away from densely integrated components more effectively.
2Volume of moving object
If conventional packaging techniques are used, then device size can be reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipation structure is nested within the package volume, with micro-channels integrated into the package substrate. This nesting approach enables effective thermal management without increasing the overall device size, as the cooling structure shares the same spatial envelope as the electronic components.
Solution Approach 2:
The invention employs fluid-based cooling by incorporating micro-channels that allow coolant flow through the package. This hydraulic approach to heat dissipation provides superior thermal management compared to conventional air cooling or passive heat sinks, enabling efficient heat removal from compact, densely integrated devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively conducts heat away from integrated circuit devices, improving thermal efficiency and managing heat loads in densely packed semiconductor packages.
Implementation Method 1
The heat dissipation structure may include a plurality of micro-channels recessed from its top surface, which may allow a cooling fluid to flow through and therefore can effectively dissipate heat generated by the integrated circuit die
Implementation Method 2
allowing a cooling fluid to flow through and therefore can effectively dissipate heat generated by integrated circuit dies
Data Source
AI summary
In an embodiment, a package includes an interposer; a first integrated circuit device attached to the interposer, wherein the first integrated circuit device includes a die and a heat dissipation structure, the die having an active surface facing the interposer and an inactive surface opposite to the active surface, the heat dissipation structure attached to the inactive surface of the die and including a plurality of channels recessed from a first surface of the heat dissipation structure, the first surface of the heat dissipation structure facing away from the die; and an encapsulant disposed on the interposer and laterally around the die and the heat dissipation structure, wherein a top surface of the encapsulant is coplanar with the top surface of the heat dissipation structure.