Embedded Microchannel PCB Cooling for High-Power Process Tool Circuits
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling systems for AC power sources in substrate processing tools are bulky, energy-intensive, and have limited cooling capacity, making them inadequate for the increasing power requirements and heat dissipation needs of advanced substrate processing systems.
Innovation Solution
A microchannel assembly cooled power circuit is introduced, which includes a microchannel layer embedded between layers of a printed circuit board. This design eliminates the need for cooling fans and provides increased cooling capacity by efficiently dissipating heat through a compact, closed-loop coolant system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional cooling systems are used for AC power sources, then cooling function is provided, but the system becomes bulky and occupies excessive space
Solution Approach 1:
The microchannel cooling plates are embedded within the printed circuit board layers, nesting the cooling system inside the existing PCB structure. This eliminates the need for separate external cooling components and reduces overall system footprint while maintaining effective cooling capacity through direct thermal coupling with power components.
Solution Approach 2:
The cooling system transitions from a two-dimensional external cooling arrangement to a three-dimensional integrated structure by embedding microchannel plates between PCB layers. This vertical integration allows cooling functionality to be incorporated within the existing PCB volume rather than requiring additional horizontal space.
2Use of energy by moving object
If traditional cooling systems with fans are used, then cooling is achieved, but energy consumption increases
Solution Approach 1:
The invention replaces mechanical fan-based forced air cooling with a fluid-based microchannel cooling system. The coolant circulates through embedded microchannels, providing passive thermal conduction and convection cooling without requiring mechanical moving parts, thereby eliminating fan energy consumption while maintaining effective heat dissipation.
Solution Approach 2:
The system uses hydraulic cooling through coolant circulation in microchannels to replace pneumatic fan cooling. The fluid-based thermal management provides more efficient heat transfer through direct contact with heated surfaces, achieving superior cooling effectiveness without the energy overhead of mechanical fans.
3Device complexity
If power circuit components are mounted on PCB, then electrical functionality is provided, but heat generation requires additional cooling infrastructure
Solution Approach 1:
The invention merges the power circuit PCB with the cooling system by embedding microchannel cooling plates between PCB layers. This integration combines electrical functionality and thermal management into a single unified structure, eliminating the need for separate cooling infrastructure while maintaining high power handling capability through direct thermal coupling with power components.
Solution Approach 2:
The PCB structure serves multiple functions simultaneously: electrical connectivity through copper traces, mechanical support for components, and thermal management through embedded microchannel cooling plates. This multi-functionality reduces overall device complexity by eliminating dedicated cooling infrastructure while maintaining high power handling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microchannel assembly cooled power circuit achieves a high heat dissipation capacity of 750 watts per square centimeter, reducing the overall footprint by approximately 60% compared to traditional designs, and eliminates the need for secondary forced convective cooling, thereby reducing energy consumption and operating costs.
Implementation Method 1
The microchannel layer includes microchannels extending from the input manifold to the output manifold and configured to pass a coolant from the input manifold to the output manifold
Implementation Method 2
achieves a high heat dissipation capacity of 750 watts per square centimeter, reducing the overall footprint by approximately 60% compared to traditional designs, and eliminates the need for secondary forced convective cooling
Data Source
AI summary
A cooling system for a power circuit of a substrate processing tool is provided. The cooling system includes a microchannel assembly and a printed circuit board. The microchannel assembly includes an input manifold, an output manifold, and a microchannel layer. The microchannel layer includes microchannels extending from the input manifold to the output manifold and configured to pass a coolant from the input manifold to the output manifold. The printed circuit board includes at least one component carrying layer, where the component carrying layer is attached to the microchannel layer between the input manifold and the output manifold. The at least one component carrying layer includes the power circuit including electrical components configured to power one or more electrical components of the substrate processing tool.