Microchannel Substrate Cooling for GPU-HBM Package Heat Dissipation
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Solution Overview
Problem
Current thermal management systems for semiconductor devices, particularly high-capacity and high-bandwidth memory devices, face challenges in dissipating heat due to space constraints and limited effectiveness of top-mounted heat spreaders, leading to performance limitations.
Innovation Solution
Integration of microchannels into the substrate beneath semiconductor devices, with a coolant flowing through these channels to dissipate heat from both memory and logic devices, enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If top-mounted heat spreaders and heatsinks are used, then heat dissipation is improved, but space constraints are violated and performance specifications are not met
Solution Approach 1:
The patent transitions from top-mounted heat dissipation structures to bottom-mounted microchannel heat sinks integrated into the substrate. This dimensional change allows heat to be dissipated from the underside of the semiconductor package, effectively utilizing previously unused space and enabling improved thermal management without increasing the overall package volume.
Solution Approach 2:
The patent employs liquid coolant flowing through microchannels etched into the substrate to transfer heat away from the semiconductor devices. This hydraulic approach uses fluid circulation to efficiently remove heat from high-power devices, achieving superior heat dissipation performance while maintaining compact form factor.
2Productivity
If semiconductor devices have greater capacities and faster performance, then device performance is improved, but heat generation increases and becomes a limiting factor
Solution Approach 1:
The patent introduces a liquid coolant as an intermediary medium to transfer heat from the semiconductor devices through the microchannel heat sinks. This mediator enables efficient thermal energy transport from high-performance devices that generate excessive heat, allowing the devices to operate at higher performance levels without thermal limitations.
Solution Approach 2:
The patent changes the thermal management approach from passive air cooling to active liquid cooling through microchannels. This parameter change in the cooling mechanism enables dissipation of higher heat loads generated by high-capacity, fast-performance semiconductor devices, removing the thermal bottleneck that previously limited device performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively conveys thermal energy away from semiconductor devices, improving heat dissipation and meeting performance specifications in space-constrained environments.
Implementation Method 1
microchannels for thermal management... coolant flowing through these channels to dissipate heat
Implementation Method 2
coolant flowing through these channels to dissipate heat from both memory and logic devices
Data Source
AI summary
Semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. The semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dissipate heat from a memory device and/or a logic device of the semiconductor package and/or assembly. The microchannel can be configured beneath the memory device and/or the logic device.