Microchannel Heat Spreader Surfaces for Underfill Flow Control
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Solution Overview
Problem
Existing optical packaging systems face issues such as incomplete encapsulation leading to reliability concerns, incompatibility with high volume manufacturing, vulnerability to mechanical and thermal shock, and uncontrolled flow of underfill and encapsulation materials.
Innovation Solution
The proposed solution involves fully encapsulating optical connectors using a lid over recessed portions of the package substrate, employing micro channels to control the flow of dispensed materials, and integrating optical fibers in a molded housing to protect them from shock and simplify assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical connectors are used to couple fibers to optics dies, then optical signal transmission is enabled, but incomplete encapsulation occurs allowing moisture and ice to compromise reliability
Solution Approach 1:
The patent merges the optical connector functionality directly into the optics die by integrating the fiber coupling structure onto the die surface. This eliminates the separate connector component and achieves complete encapsulation of the optical path within the sealed package, preventing moisture ingress while maintaining optical signal transmission capability.
Solution Approach 2:
The patent implements nested encapsulation by placing the optics die with integrated fiber coupling within a sealed package cavity, then enclosing the entire assembly with a lid that creates a hermetic seal. This nested structure ensures complete encapsulation of all optical components against environmental contaminants.
2Reliability
If exposed optical fibers are used for fiber coupling, then assembly flexibility is maintained, but vulnerability to mechanical shock and thermal shock increases
Solution Approach 1:
The patent combines the optical fiber coupling function directly onto the optics die surface through integrated V-grooves and fiber retention structures. This eliminates exposed loose fibers and provides mechanical protection while maintaining the ability to couple fibers during the packaging process.
Solution Approach 2:
The patent provides beforehand protection by enclosing the fiber coupling structures within a sealed package cavity before final assembly completion. The encapsulation material fills and protects the cavity, cushioning the fiber coupling structures against mechanical shock and thermal shock during subsequent handling and solder reflow processes.
3Manufacturing precision
If material is dispensed on planar surfaces for underfill and encapsulation, then application is simple, but location and uniformity control is difficult
Solution Approach 1:
The patent applies local quality by creating micro channels with specific geometries (varying width, depth, and cross-section) in the encapsulation material. These localized structural variations guide material flow paths and control dispensing behavior at specific locations, achieving precise material placement and uniformity without complex external control systems.
Solution Approach 2:
The patent utilizes non-planar surface features including micro channels with curved or tapered geometries to control material flow. The curved surfaces and varying cross-sections of the micro channels create capillary pressure gradients that guide encapsulation material to specific locations and control its distribution uniformity.
4Area of stationary object
If large external fiber shufflers are used for routing optical fibers, then fiber routing flexibility is achieved, but package footprint increases
Solution Approach 1:
The patent merges the fiber shuffling and routing function directly into the optics die and package substrate by integrating V-groove arrays and fiber alignment structures onto these surfaces. This eliminates the need for separate external fiber shufflers and achieves compact fiber routing within the package footprint.
Solution Approach 2:
The patent utilizes the vertical dimension by routing fibers through the package depth using micro channels and stacked die configurations. This three-dimensional fiber routing approach replaces traditional two-dimensional planar fiber shufflers, significantly reducing the horizontal footprint while maintaining fiber routing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and ease of assembly of multi-chip optical packages by ensuring complete encapsulation, reducing the footprint of optical systems, and improving manufacturability.
Implementation Method 1
micro channels to control the flow of dispensed materials
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3~4A
AI summary
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.