Microchip Affixing Probe for Plastic Embedding
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Solution Overview
Problem
Silicon-based microchips with dimensions of 500 microns or less are difficult to affix reliably and durably to plastic items, such as those in biorepositories, due to their small size and the need for strong, reliable attachment.
Innovation Solution
A microchip affixing method involving a vacuum probe with a heating element that adheres and heats the microchip to embed it into the plastic, ensuring secure attachment, and a robotic system for precise alignment and application, utilizing a probe with dimensions comparable to or smaller than the chip, and heating the chip to a temperature above the plastic's melting point.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional affixing methods are used for microchips, then the attachment strength may be sufficient, but the reliability and durability of attachment for chips 500 microns or less deteriorates
Solution Approach 1:
The invention changes the physical state of the plastic substrate by heating it to melting temperature, transforming it from a solid state that cannot bond to microchips into a molten state that can envelop and bond with the chip. This parameter change (temperature) enables reliable attachment of microchips 500 microns or less to the plastic substrate.
Solution Approach 2:
The invention utilizes the phase transition of the plastic substrate from solid to molten state through heating. The plastic is heated to its melting temperature, allowing it to flow and envelop the microchip, then cools and solidifies to create a durable, reliable bond. This phase transition is essential for achieving reliable attachment of small microchips.
2Ease of operation
If a large probe is used for affixing, then the handling is easier, but the alignment precision for small microchips deteriorates
Solution Approach 1:
The probe is segmented into distinct functional zones: a larger handle portion for easy grasping and manipulation, and a progressively smaller shaft and tip portion for precise alignment with the microchip. This segmentation allows the probe to provide both ease of operation and manufacturing precision simultaneously.
Solution Approach 2:
Different portions of the probe have different dimensional characteristics optimized for different functions. The handle has larger dimensions for ease of handling, while the tip has dimensions comparable to or smaller than the chip for precise alignment. This local quality variation resolves the contradiction between ease of operation and alignment precision.
3Manufacturing precision
If the probe size is reduced to match chip dimensions, then the alignment precision improves, but the ease of operation deteriorates
Solution Approach 1:
The probe is segmented into distinct functional zones: a larger handle portion for easy grasping and manipulation, and a progressively smaller shaft and tip portion for precise alignment with the microchip. This segmentation allows the probe to provide both ease of operation and manufacturing precision simultaneously.
Solution Approach 2:
Different portions of the probe have different dimensional characteristics optimized for different functions. The handle has larger dimensions for ease of handling, while the tip has dimensions comparable to or smaller than the chip for precise alignment. This local quality variation resolves the contradiction between ease of operation and alignment precision.
4Strength
If heating temperature is increased to melt plastic, then the bonding strength improves, but the risk of damaging the microchip increases
Solution Approach 1:
The probe acts as an intermediary heat transfer medium between the heat source and the microchip-plastic interface. It conducts heat precisely to the bonding zone, allowing the plastic to reach melting temperature for strong bonding while the brief contact time and localized heating prevent thermal damage to the microchip.
Solution Approach 2:
The heating process is performed rapidly and locally, rushing through the heating phase before thermal damage can occur to the microchip. The probe heats the plastic to melting temperature quickly, achieves bonding, and then the process is complete, minimizing the time the chip is exposed to high temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for efficient and reliable attachment of microchips to plastic items, ensuring strong and durable bonding, with the ability to affix multiple chips per minute while maintaining machine-readable barcodes and precise alignment.
Implementation Method 1
vacuum adhering a top-oriented surface of the chip to a probe
Implementation Method 2
conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic
Implementation Method 3
a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; applying via the probe the chip to the plastic such that the chip embeds in the plastic
Data Source
AI summary
Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.