Microchip Bonding via Segmented Noncontact Zones
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Solution Overview
Problem
Large-sized microchips face issues with warping and undulation of substrates during bonding, leading to unfavorable bonding states and sample leakage, as conventional methods require increased pressure or temperature to achieve bonding, which can deform channels.
Innovation Solution
A microchip design featuring a noncontact portion surrounding the bonding area between resin substrates, with angles greater than 90 degrees between channel forming steps and bonding surfaces, and optionally chamfered or rounded edges, allowing for effective bonding without increasing pressing force, heating temperature, or heating time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the microchip size is increased to meet application requirements, then the coverage area is improved, but substrate warping and bonding surface undulation occur leading to unfavorable bonding states
Solution Approach 1:
The bonding surface is divided into a bonding portion and a noncontact portion. The noncontact portion is positioned at a higher level than the bonding portion, creating a stepped structure. This segmentation allows the bonding portion to maintain good contact between substrates while the noncontact portion accommodates substrate warping, thus resolving the contradiction between large area and bonding precision.
Solution Approach 2:
Different portions of the bonding surface are given different heights and functions. The bonding portion is kept at a lower level for optimal bonding contact, while the noncontact portion is elevated to prevent interference with bonding. This local differentiation enables large microchips to achieve favorable bonding states by optimizing each region's characteristics.
2Manufacturing precision
If pressing force is increased to achieve favorable bonding state, then bonding quality is improved, but channel deformation occurs
Solution Approach 1:
By segmenting the bonding surface into bonding and noncontact portions with different heights, the invention creates a structure where bonding occurs at the lower bonding portion while the elevated noncontact portion prevents excessive pressing force transmission. This allows achieving favorable bonding states without applying excessive pressure that would deform the channels.
3Manufacturing precision
If heating temperature or time is increased to achieve favorable bonding state, then bonding quality is improved, but channel deformation occurs
Solution Approach 1:
The stepped structure with bonding and noncontact portions allows bonding to proceed at moderate temperatures and times. The elevated noncontact portion prevents excessive thermal expansion and deformation of channels while still enabling sufficient heat transfer for bonding at the bonding portion, thus avoiding channel deformation.
4Strength
If activation treatment is applied to improve bonding, then bonding strength is improved, but substrate warping is exacerbated
Solution Approach 1:
By creating a stepped structure where the noncontact portion is elevated, the invention allows activation treatment to be applied uniformly across the substrate surface without causing excessive warping. The elevated noncontact portion provides compensation space for thermal expansion and warping during activation treatment, while the bonding portion maintains sufficient contact for strong bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a favorable bonding state for large microchips, ensuring reliable formation of channels without deformation, even when substrates are warped, and enhances bonding strength and optical observation capabilities.
Implementation Method 1
a vacuum ultraviolet irradiation treatment of irradiating the front surfaces with vacuum ultraviolet rays
Implementation Method 2
a plasma treatment of bringing the front surfaces into contact with atmospheric pressure plasma
Implementation Method 3
either one or both of a heating treatment and a pressure treatment are performed
Implementation Method 4
either one or both of a heating treatment and a pressure treatment are performed
Data Source
AI summary
Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size.A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle θ1 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies θ1>90°.