Microchip Elastic Channel Covering for Stable Fluid Volume
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Solution Overview
Problem
Conventional microchip manufacturing processes are complex and costly, with issues of solvent usage leading to leakage and uneven adhesion, making it difficult to achieve a stable channel volume, and there is a risk of solvent reacting with bio-substances.
Innovation Solution
A microchip design featuring a first plate with a channel covering portion and a tension generating connector that elastically contacts a supporting wall on a second plate, ensuring a stable channel structure through precise adhesion and preventing leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solvent adhesion is used to bond the upper plate and lower plate, then the plates can be adhered together, but the solvent may react with bio-substances in the channel inducing undesired biological or chemical reactions
Solution Approach 1:
The patent removes the solvent adhesion step entirely from the manufacturing process. The upper plate and lower plate are bonded through direct mechanical contact and structural design (interlocking features, surface contact areas) without requiring any solvent or chemical adhesive, thereby eliminating the harmful solvent-bio substance reaction while maintaining adhesion strength
Solution Approach 2:
The patent introduces an intermediary bonding mechanism through structural features such as protrusions, recesses, and surface contact areas that mediate the bonding between plates. This mechanical intermediary replaces the chemical intermediary (solvent), providing adhesion without chemical reactions that could harm bio-substances
2Shape
If the upper plate and lower plate are adhered using solvent or film lamination, then the channel is formed, but the manufacturing process becomes complicated and difficult
Solution Approach 1:
The patent segments the manufacturing process into simple, discrete steps: forming the lower plate with channel structure, forming the upper plate with opening, and bonding them through direct contact. This segmentation eliminates complex multi-step processes like film lamination or solvent coating, reducing manufacturing complexity while maintaining channel structure integrity
Solution Approach 2:
Instead of forming the channel by laminating films or coating solvents onto plates, the patent inverts the approach by forming complete plates with pre-defined channel structures and bonding them directly. This inversion simplifies the process from complex surface treatment to simple structural assembly
3Strength
If solvent is used for adhesion, then the plates can be bonded, but the solvent may cause uneven coating or uneven surfaces resulting in incomplete adhesion and solution leakage
Solution Approach 1:
The patent extracts the solvent from the adhesion process entirely, replacing it with direct mechanical bonding through surface contact and interlocking features. This eliminates the source of uneven coating and surface irregularities, ensuring uniform and complete adhesion without the variability introduced by solvent application
Solution Approach 2:
The bonding surfaces are designed to self-align and self-bond through their geometric features (protrusions, recesses, contact areas). This self-service mechanism eliminates the need for manual solvent application and ensures uniform adhesion through precise mechanical fit, reducing dependency on operator skill and environmental conditions
4Productivity
If conventional adhesion methods are used, then the plates can be bonded, but automatic equipment is required for mass-manufacture and manufacturing cost increases
Solution Approach 1:
The patent segments the bonding interface into discrete, standardized features (protrusions, recesses, contact areas) that can be easily manufactured using standard molding or machining processes. This segmentation enables simple automated assembly through robotic insertion or snap-fit mechanisms, reducing the need for complex bonding equipment and lowering manufacturing costs for mass production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microchip achieves a stable and consistent channel volume with reduced manufacturing complexity and cost, while minimizing the risk of solvent-bio substance reactions.
Implementation Method 1
a tension generating connector configured to connect the channel covering portion to the first adhesion portion so that the channel covering portion is in elastically close contact with a channel forming area of the second plate
Data Source
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AI summary
Disclosed is a microchip. The microchip of the present invention is characterized by comprising: a first plate; and a second plate coupled to the first plate to form a channel, wherein the first plate comprises: a channel cover part; a first connection part spaced apart from the outer periphery of the channel cover part by a certain distance; and a tensile strength generation connecting part for mutually connecting the channel cover part and the first connection part so that the channel cover part elastically contacts the channel region formed on the second plate when the first plate is coupled to the second plate. According to the present invention, the channel cover part forming the channel elastically contacts the channel region formed on the second plate, thereby providing a microchip capable of providing a channel having a stable structure.