Compact Microchip Laser Optical Fiber Cleaving Apparatus
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Solution Overview
Problem
Existing optical fiber cleaving methods are prone to damage and variability in end face angle, and laser-based solutions are either too large or too costly for a compact, affordable tool.
Innovation Solution
A compact optical fiber cleaving apparatus using a microchip laser system that generates a focused laser beam with a peak irradiance exceeding the optical damage threshold, forming a micro-crack in the fiber to achieve a clean cleave, comprising a microchip laser system, optical fiber holder, and optical system to form a focused beam with a numerical aperture of 0.1≤NA≤0.6.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If mechanical scribing and breaking is used to cleave optical fiber, then the process is simple and equipment is compact, but the end face suffers damage and has angle variation
Solution Approach 1:
The patent replaces the mechanical scribing and breaking system with a laser-based system. A laser beam is focused to create a micro-crack in the optical fiber by exceeding the optical damage threshold irradiance, which then propagates to form a clean cleaved end face. This substitution eliminates mechanical contact that causes damage and angle variation while maintaining compact device complexity through the use of a microchip laser system.
2Manufacturing precision
If conventional laser-based ablation is used for optical fiber cleaving, then end face quality improves, but the laser systems are too large and costly for field use
Solution Approach 1:
The patent changes the parameters of the laser system by using a microchip laser that operates at specific wavelengths (e.g., 1064 nm, 532 nm, 355 nm, or 266 nm) with controlled pulse durations and peak irradiances. By optimizing these parameters to exceed the optical damage threshold of the fiber material, the system achieves effective cleaving with a compact, affordable device suitable for field use.
Solution Approach 2:
The patent employs a microchip laser system that is significantly smaller and more affordable than conventional laser systems. This compact laser can be easily handled and transported by technicians in the field, making high-quality laser-based cleaving accessible without the size and cost constraints of traditional laser systems.
3Manufacturing precision
If high peak irradiance is applied to form micro-crack, then cleaving precision improves, but risk of fiber damage increases
Solution Approach 1:
The patent uses pulsed laser operation where the laser beam is delivered in discrete pulses with specific duration and repetition rates. This periodic action allows the fiber to dissipate heat between pulses, preventing excessive thermal damage while accumulating the necessary energy to form a controlled micro-crack. The pulsed regime enables precise control over the micro-crack formation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively forms a flat, minimally angled cleaved end face with controlled micro-crack formation, suitable for fusion splicing or connectorization, while being compact and affordable for field use.
Implementation Method 1
a microchip laser system configured to generate an initial laser beam having a wavelength in the range from 266 nanometers (nm) to 1600 nm, and optical pulses with a pulse duration between 200 ns and 200 ps
Implementation Method 2
an optical system configured to receive the initial laser beam and form therefrom a focused laser beam having a numerical aperture NA in the range 0.1≤NA≤0.6 and a focus spot
Implementation Method 3
The focus spot has a peak optical irradiance that exceeds the optical damage threshold irradiance in order to form a micro-crack in an optical damage zone within the bare fiber section
Data Source
AI summary
An optical fiber cleaving apparatus that employs a microchip laser system for cleaving an optical fiber is disclosed. The microchip laser system is operably arranged relative to an optical system that receives an initial laser beam and forms a focused laser beam that includes a focus spot. The focus spot is directed to the outer surface of the optical fiber to create an optical damage zone that includes at least one micro-crack necessary for performing the cleaving operation. Methods of aligning the optical fiber to the focus spot and performing the cleaving operation using the cleaving apparatus are also disclosed.