Microchip Optical Path Segmentation for Welding Reliability
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Solution Overview
Problem
In microchips with fluid circuits, the raised substrate during welding can interrupt the optical path in the detection portion, making reliable optical measurements difficult and requiring increased specimen and reagent amounts to compensate, which diminishes the microchip's advantages.
Innovation Solution
A microchip design featuring a first substrate with a grooved surface and a second substrate joined together, where the groove defines the optical path and includes steps on the first substrate to accommodate the raised second substrate, preventing optical path interruption, and using a transparent first substrate and opaque second substrate for efficient welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are joined together by melting with a laser or the like to weld them, then the substrates can be firmly joined, but the melted substrate is often raised and interrupts the optical path
Solution Approach 1:
The detection portion is divided into multiple levels using steps on the first substrate. The optical path is segmented into different vertical zones, with the lower level containing the step structure that captures the raised substrate material, and the upper level maintaining the optical path. This segmentation allows the raised substrate to be contained without blocking light transmission.
Solution Approach 2:
The solution moves from a two-dimensional flat substrate interface to a three-dimensional structured interface with steps and recesses. By creating vertical depth variations through steps on the first substrate and corresponding recesses on the second substrate, the raised material is accommodated in the vertical dimension rather than protruding into the optical path.
2Reliability
If the optical path is increased in length in the microchip's depthwise direction to avoid interruption, then optical measurement can be maintained, but increased amounts of specimen and liquid reagent are required
Solution Approach 1:
The optical path is segmented vertically into different levels. The light transmission path is maintained at the upper level where no substrate material protrudes, while the lower level contains the step structure that captures raised material. This allows the optical path to remain uninterrupted without requiring increased path length.
Solution Approach 2:
Instead of extending the optical path length, the invention creates a parallel solution by forming a stepped copy of the substrate structure that redirects the raised material away from the optical path, effectively copying the functional outcome without the detrimental side effect of increased path length.
3Reliability
If steps are formed on the first substrate and recesses on the second substrate to accommodate raised substrate, then the optical path is prevented from being interrupted, but the device structure becomes more complex
Solution Approach 1:
The invention changes the geometric parameters of the substrate interface by introducing step depths and recess dimensions. These parameter changes create the necessary three-dimensional structure to accommodate raised material while maintaining a relatively simple overall device architecture that can be fabricated using standard microfabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents optical path interruption, ensuring reliable optical measurements while maintaining the microchip's advantages of reduced specimen and reagent amounts, thus maximizing its utility.
Implementation Method 1
The substrates can be joined together for example by melting with a laser or the like a surface of at least one substrate that is joined to the other, and thus welding the substrates together.
Implementation Method 2
by melting with a laser or the like a surface of at least one substrate that is joined to the other
Implementation Method 3
The detection portion having the liquid mixture accommodated therein is for example exposed to light (for detection) to measure the liquid mixture in transmittance or subject it to similar optical measurement.
Data Source
AI summary
There is provided a microchip that is formed of a first substrate having a surface with a groove and a second substrate joined together and has a fluid circuit in the form of a cavity defined by the groove and a surface of the second substrate closer to the first substrate. The fluid circuit at least includes a detection portion having an optical path for transmitting light. The microchip includes at least one of a step defined by a groove formed in contact with at least one side surface of a groove of the first substrate that defines the optical path and a recess provided in the second substrate at a position opposite to the step.