Microchip Oxygen Sensor with Intermeshing Electrodes for Small Engine Control

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Solution Overview

Problem

Current oxygen sensors for internal combustion engines, particularly those used in small engines, are cost-prohibitive and unsuitable for small engine markets due to their expensive nature and limited size reduction potential, making them ineffective for emission control and safety applications in motorcycles, ATVs, and hybrid engines.

Innovation Solution

A sub-miniature microchip oxygen sensor is developed using a thin ceramic substrate with multiple thin heater patterns and intermeshing comb-shaped electrodes, a semiconducting layer, and a porous protective dielectric layer, allowing for reduced size and cost while maintaining functional characteristics such as resistance changes and chemical stability, enabling individual cylinder control and safety features.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional oxygen sensors are used for emission control in small engines, then measurement precision is improved, but cost increases making them prohibitive for small engine markets

Engineering Contradiction:
Improveair-fuel ratio sensing accuracyVSAvoidsensor cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent employs a resistive sensor design using titania-based semiconductor material that can be manufactured at lower cost compared to conventional zirconia sensors. The sensor utilizes a simpler structure without requiring heated elements or complex voltage generation mechanisms, enabling cost-effective production for small engine applications while maintaining functional capability for emission control

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent transitions from voltaic sensor technology (voltage-based measurement) to resistive sensor technology (resistance-based measurement). This parameter change in the sensing mechanism allows for simplified construction and reduced manufacturing cost while still providing the necessary measurement precision for air-fuel ratio control in small engines

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If conventional oxygen sensors are used in small engines, then measurement precision is improved, but device size remains large limiting size reduction potential

Engineering Contradiction:
Improveair-fuel ratio sensing accuracyVSAvoidsensor size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The resistive sensor design inherently allows for miniaturization compared to conventional sensors. The titania-based semiconductor layer can be deposited on small substrates, and the sensor structure does not require large heated elements or complex internal geometry, enabling significant size reduction for compact small engine installations

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent utilizes thin film deposition techniques to create the titania-based semiconductor sensing layer on a substrate. This thin-film approach enables the sensor to be made extremely compact while maintaining the necessary sensing surface area and electrical properties for accurate measurement

Inventive Principle:
Principle #30Flexible shells and thin films

3Measurement precision

If heated oxygen sensors are used to improve functionality, then measurement precision is improved, but power consumption increases

Engineering Contradiction:
Improvesensor functionalityVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The resistive sensor operates at ambient temperature without requiring heated elements. The titania-based semiconductor material exhibits resistance changes in response to oxygen concentration variations directly at operating temperature, eliminating the need for continuous heating and thus reducing power consumption significantly compared to heated oxygen sensors

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent replaces the thermal heating mechanism with an electrical resistance measurement mechanism. Instead of using heat to activate the sensor and maintain its functionality, the sensor directly measures oxygen concentration through resistance changes at ambient temperature, substituting a thermal system with an electrical measurement system that consumes less power

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The microchip oxygen sensor provides cost-effective and compact solutions for small engine markets, enabling precise air-fuel ratio control and safety features, such as preventing noxious gas production, with reduced power requirements and interchangeability with conventional zirconia sensors.

Implementation Method 1

A heater pattern is affixed to the substrate

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

A second type of sensor known as a resistive sensor relies on a step-wise change in resistance of a semiconductor material

Methodology Applied
Scientific EffectResistive sensing: Electrical Resistance

Data Source

PatentUS10526945B2Microchip oxygen sensor for control of internal combustion engines or other combustion processes
Publication Date: 2020.01.07 KERDEA TECHNOLOGIES INC
  • US10526945B2 patent drawing
  • US10526945B2 patent drawing
  • US10526945B2 patent drawing

AI summary

A microchip oxygen sensor for sensing exhaust gases from a combustion process, and related methods. The microchip oxygen sensor includes a dielectric substrate and a heater pattern affixed to the substrate. A first electrode is affixed to the substrate and has a first plurality of fingers forming a first comb. A second electrode is affixed to the substrate and has a second plurality of fingers forming a second comb. The second electrode is disposed in spaced relation to the first electrode such that the first and second combs face each other. A semiconducting layer is disposed over the first and second electrodes so as form a physical semiconductor bridge between the first and second electrodes. The semiconducting layer comprises an n-type semiconducting material or a p-type semiconducting material. A porous dielectric protective layer, advantageously containing a catalytic precious metal, may cover the semiconducting layer.