Resin Microchip Substrate with Inclined Cylindrical Walls
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Solution Overview
Problem
Conventional methods for producing resinous microchips face challenges in arranging cylindrical parts at fine pitches due to mold releasing deformation and wall thickness requirements, with existing techniques either increasing mold releasing resistance or causing deformation and flatness issues.
Innovation Solution
A resinous substrate design with specific inclination angles for the outer and inner walls of cylindrical parts, where the absolute value of the first inclination angle of the inner wall is greater than the second inclination angle of the outer wall, reduces mold releasing resistance and deformation, allowing for efficient arrangement of cylindrical parts at fine pitches while maintaining required strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the injection pressure and injection speed are increased to ensure advanced transferability of the fine channel, then the transferability of the fine channel is improved, but the mold releasing resistance increases making release difficult
Solution Approach 1:
The patent applies parameter changes by optimizing the injection molding parameters (pressure, speed, temperature) to achieve the right balance between fine channel transferability and mold releasing. By carefully controlling these parameters, the process ensures adequate transferability without excessive mold releasing resistance.
2Ease of manufacture
If undue force is applied to release the product from the mold, then the mold releasing is achieved, but distortion remains on the bonded surface
Solution Approach 1:
The patent applies preliminary action by incorporating draft angles on the cylindrical parts during mold design. This preliminary geometric feature allows the molded product to be released from the mold with minimal force, preventing distortion on the bonded surface while still achieving successful mold releasing.
3Manufacturing precision
If increase of the mold releasing resistance occurs, then the fine channel transferability is improved, but the fine channel is deformed at the time of mold separation
Solution Approach 1:
The patent applies parameter changes by optimizing the draft angle parameter of the cylindrical parts. By setting appropriate draft angles, the design achieves sufficient fine channel transferability while ensuring that the cylindrical parts maintain their shape integrity during mold separation, preventing deformation.
4Productivity
If cylindrical parts are arranged at a finer pitch, then a great number of cylindrical parts can be provided on the substrate, but the wall thickness of the cylindrical part must be increased to meet strength requirements
Solution Approach 1:
The patent applies parameter changes by optimizing the draft angle parameter of the cylindrical parts. By setting appropriate draft angles, the design achieves sufficient fine channel transferability while ensuring that the cylindrical parts maintain their shape integrity during mold separation, preventing deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate enables the arrangement of multiple cylindrical parts at fine pitches with reduced deformation and maintains the necessary wall thickness, enhancing the production efficiency and quality of resinous microchips.
Implementation Method 1
an injection molding technique for forming a fine channel on a plate-formed substrate
Implementation Method 2
the force of bringing the inner wall of the through-hole in closer contact with the mold is increased by the shrinkage of the molded resin
Data Source
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Figure 5
AI summary
A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.