Microchip Transfer Alignment Using Liquid Flow and Chip Recovery
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Solution Overview
Problem
The pick-and-place method for transferring micro-LEDs in manufacturing micro-LED display devices results in decreased productivity as the size of micro-LEDs decreases and display size increases, making it inefficient for high-resolution display production.
Innovation Solution
A micro-semiconductor chip transfer apparatus that includes a wet chip supply module, a chip alignment module with an absorber for aligning micro-semiconductor chips in grooves of a transfer substrate, and a chip extraction module using various cleaning methods such as liquid spray, ultrasonic, or vibration to extract and reuse the chips, improving alignment accuracy and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the pick-and-place method is used for transferring micro-LEDs, then the transfer process can be performed with simple equipment, but productivity decreases as micro-LED size decreases and display size increases
Solution Approach 1:
The patent employs a liquid flow system where a liquid carrier transports micro-LEDs to the display substrate. The liquid flow method enables parallel transfer of multiple micro-LEDs simultaneously, dramatically increasing productivity compared to sequential pick-and-place operations while maintaining relatively simple equipment requirements.
Solution Approach 2:
The patent introduces a liquid carrier as an intermediary medium between the micro-LED source and the display substrate. This liquid mediator enables efficient mass transfer of micro-LEDs, solving the productivity limitation of direct pick-and-place methods while keeping the transfer mechanism simple.
2Ease of manufacture
If micro-LEDs are transferred to a display substrate, then display devices can be manufactured, but micro-LED waste increases and reuse becomes necessary
Solution Approach 1:
The patent implements a recovery system where excess micro-LEDs and those not properly positioned on the display substrate are collected from the liquid carrier. These recovered micro-LEDs can be reused in subsequent transfer operations, reducing waste and manufacturing costs while maintaining ease of display production.
3Manufacturing precision
If micro-semiconductor chips are aligned in grooves of a transfer substrate, then alignment accuracy improves, but chip extraction and reuse becomes more complex
Solution Approach 1:
The patent employs an extractor mechanism that selectively removes aligned micro-LEDs from the liquid carrier and transfers them to the display substrate. This extraction process maintains alignment accuracy by preserving the groove positioning while enabling chip reuse, balancing precision requirements with operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances the alignment accuracy and productivity of micro-semiconductor chip transfer by enabling efficient reuse of micro-semiconductor chips, reducing waste, and improving the efficiency of high-resolution display manufacturing.
Implementation Method 1
a chip alignment module comprising an absorber configured to move along a surface of the transfer substrate to align first micro-semiconductor chips, among the plurality of micro-semiconductor chips, respectively in the plurality of grooves and to absorb the first liquid
Implementation Method 2
a liquid spray cleaner configured to spray a second liquid to the absorber to extract the second micro-semiconductor chips from the absorber
Implementation Method 3
an ultrasonic cleaner configured to emit ultrasonic waves towards the absorber to extract the second micro-semiconductor chips from the absorber
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.