Microchip Mass Transfer With Empty-Groove Compensation
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Solution Overview
Problem
The productivity of micro LED display apparatus manufacturing decreases as the size of micro LED chips diminishes and the size of the display apparatus increases, due to inefficiencies in mass-transfer methods such as laser lift off and pick and place, which struggle with accurately positioning micro semiconductor chips in grooves on substrates.
Innovation Solution
A mass-transfer method and device that utilize fluidic self-assembly and electrostatic or electromagnetic forces to position micro semiconductor chips in grooves on a substrate, detecting empty grooves and transferring identical chips to fill them, thereby improving transfer yield and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser lift off or pick and place method is used to transfer micro LED chips, then the micro LED chips can be transferred onto the substrate, but the productivity decreases as the size of micro LED chips decreases and the size of display apparatus increases
Solution Approach 1:
The micro LED chips perform self-assembly through fluidic forces, automatically positioning themselves into the correct grooves on the substrate without requiring complex external manipulation. This self-service mechanism maintains high positioning accuracy while dramatically improving transfer efficiency, as the chips organize themselves through the flow field rather than requiring precise mechanical placement for each chip
Solution Approach 2:
The invention utilizes fluidic forces (hydraulic principle) to transport and position micro LED chips. By controlling the fluid flow through channels and grooves, the system achieves both high-speed mass transfer and precise positioning, resolving the contradiction between productivity and manufacturing precision that plagues traditional mechanical methods
2Productivity
If traditional mass-transfer methods are used, then chips can be transferred in bulk, but empty grooves remain and transfer yield is low
Solution Approach 1:
The system incorporates detection means to identify empty grooves after the initial mass transfer, and then uses this feedback information to guide a second transfer operation that specifically targets and fills the empty grooves. This closed-loop feedback mechanism ensures high transfer yield by systematically addressing all empty positions while maintaining mass transfer efficiency
Solution Approach 2:
The invention performs a preliminary mass transfer of chips to the substrate first, then uses detection and supplementary transfer to fill empty grooves. This preliminary action approach allows the system to handle the bulk transfer efficiently while subsequently addressing the remaining empty positions, thereby maintaining both productivity and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the transfer yield of micro semiconductor chips by accurately positioning them in grooves, addressing the productivity issues faced in manufacturing micro LED display apparatuses, particularly by using fluidic self-assembly and electrostatic or electromagnetic forces to complement empty spaces.
Implementation Method 1
positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force
Implementation Method 2
positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force
Implementation Method 3
The plurality of first micro semiconductor chips may be transferred onto the first substrate by a fluidic self assembly method
Data Source
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AI summary
A method of mass-transferring a plurality of micro semiconductor chips, including mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that they are disposed in a plurality of first grooves of the first substrate; determining whether an empty first groove is present; and positioning a second micro semiconductor chip in the empty first groove, wherein the positioning may include transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate; and adsorbing the second micro semiconductor chip from the second substrate, and positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.