Microchip Suspension Transfer With Filtration for Precise Alignment
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Solution Overview
Problem
The productivity of micro LED display device manufacturing is hindered by the pick-and-place method, which becomes less efficient as micro LED sizes decrease and display sizes increase, due to challenges in effectively transferring and aligning micro-semiconductor chips on substrates.
Innovation Solution
A chip transfer apparatus utilizing a wet method with a chip filtration module that separates micro-semiconductor chips from impurities using sonophoretic dynamics, dielectrophoresis, magnetophoretic dynamics, microfluidic dynamics, centrifugal force, or pinched flow fractionation, allowing for precise alignment and transfer of micro-semiconductor chips onto a transfer substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick-and-place method is used to transfer micro LEDs, then the transfer process can be performed, but productivity is lowered as micro LED size decreases and display size increases
Solution Approach 1:
The transfer substrate is divided into multiple grooves that can simultaneously accommodate multiple micro-LED chips. The chip suspension is segmented into individual chips that can be independently positioned in each groove, enabling parallel transfer operations that significantly improve productivity compared to sequential pick-and-place methods.
Solution Approach 2:
A liquid suspension medium is used to carry micro-LED chips to the transfer substrate. The suspension flow dynamics enable chips to be transported and positioned through fluidic control rather than mechanical manipulation, simplifying the transfer process and enabling high-throughput operations.
2Speed
If micro-LED chips are transferred using suspension flow, then transfer speed increases, but unintended chip flow and misalignment occur
Solution Approach 1:
Each groove on the transfer substrate has specific local characteristics (shape, depth, position) that are tailored to accommodate and guide micro-LED chips into correct alignment. The varying flow velocities at different locations in the suspension flow enable precise positioning of chips into corresponding grooves, maintaining alignment precision despite high transfer speeds.
Solution Approach 2:
The suspension flow is controlled to exhibit periodic or pulsed characteristics that facilitate chip deposition. By controlling the flow dynamics to have periodic acceleration and deceleration phases, chips are delivered to the substrate in a controlled manner that prevents unintended flow while maintaining high transfer speed.
3Ease of manufacture
If impurities are present in the chip suspension, then the suspension can be easily prepared, but transfer yield decreases due to impurity interference
Solution Approach 1:
Impurity removal actions are performed preliminarily during suspension preparation or before the transfer process. By incorporating filtration, centrifugation, or sedimentation steps before chip transfer, the suspension is pre-cleaned to remove debris and contaminants, ensuring high transfer yield while maintaining ease of overall process execution.
Solution Approach 2:
An intermediary medium or component is introduced to facilitate impurity separation. This could be a filtration layer, centrifugal field, or density-based separation mechanism that acts as an intermediary between the chip suspension and the transfer substrate, allowing impurities to be removed while preserving the chips for transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the transfer yield and efficiency by separating and aligning micro-semiconductor chips on a substrate, improving the productivity of micro LED display device manufacturing by preventing unintended chip flow and minimizing impurity interference.
Implementation Method 1
The chip filtration module may be further configured to separate the suspension into the first suspension and the second suspension using at least one of sonophoretic dynamics, dielectrophoresis, magnetophoretic dynamics, microfluidic dynamics, centrifugal force, or pinched flow fractionation.
Implementation Method 2
The chip filtration module may be further configured to separate the suspension into the first suspension and the second suspension using at least one of sonophoretic dynamics, dielectrophoresis, magnetophoretic dynamics, microfluidic dynamics, centrifugal force, or pinched flow fractionation.
Implementation Method 3
The chip filtration module may be further configured to separate the suspension into the first suspension and the second suspension using at least one of sonophoretic dynamics, dielectrophoresis, magnetophoretic dynamics, microfluidic dynamics, centrifugal force, or pinched flow fractionation.
Implementation Method 4
The chip filtration module may be further configured to separate the suspension into the first suspension and the second suspension using at least one of sonophoretic dynamics, dielectrophoresis, magnetophoretic dynamics, microfluidic dynamics, centrifugal force, or pinched flow fractionation.
Data Source
AI summary
A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.