Microcircuit Cochlear Electrode Array Helical Overmolding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cochlear electrode manufacturing processes are slow, prone to mechanical stresses, and result in high material waste due to manual handling and intervention, leading to inefficiencies and increased breakage.
Innovation Solution
A microcircuit integrated cochlear electrode array is designed with a flat multiconductor head and tail portion, where the tail is helically wrapped with ring electrodes and overmolded with a polymeric material, reducing operator intervention through a process involving nonconductive film substrates, laser machining, and overmolding to enhance robustness and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual handling and operator intervention are used throughout the manufacturing process, then the electrodes can be carefully assembled, but the processing speed is slow and mechanical stresses cause breakage
Solution Approach 1:
The patent replaces manual mechanical handling with automated laser machining and overmolding processes. The laser machine vision system automatically guides laser cutting and drilling operations, eliminating manual intervention while maintaining precision. The overmolding process automatically forms the electrode array structure without manual assembly, reducing mechanical stresses from handling.
Solution Approach 2:
The patent changes the physical state and properties of materials during manufacturing. The polymeric material transitions from liquid monomer to solid polymer through light-induced polymerization during overmolding. This parameter change enables automated formation of the electrode structure with precise control over mechanical properties, reducing breakage while maintaining integrity.
2Ease of manufacture
If manual formation and handling of electrodes are used, then flexibility in assembly is maintained, but material waste and rework increase
Solution Approach 1:
The patent performs preliminary actions by pre-forming the complete electrode array structure through overmolding before any electrode-specific operations. The polymeric material is molded with integrated features including electrode positions, connections, and protective structures all in one operation. This preliminary formation eliminates subsequent material waste from manual cutting, assembly errors, and rework.
Solution Approach 2:
The polymeric material serves multiple functions simultaneously: it provides structural support, electrical insulation, mechanical protection, and positional alignment for electrodes. The overmolded structure integrates multiple components that would otherwise require separate manufacturing steps, reducing material waste while maintaining manufacturing flexibility through the universal polymeric matrix.
3Productivity
If automated processes are implemented to increase throughput, then productivity improves, but process complexity increases
Solution Approach 1:
The patent merges multiple manufacturing operations into integrated automated processes. The overmolding process combines molding, electrode positioning, connection formation, and protective coating in a single automated operation. The laser machine vision system integrates cutting, drilling, and positioning functions. This merging increases throughput while managing complexity through consolidation rather than multiplication of separate complex steps.
Solution Approach 2:
The automated system performs self-service through the laser machine vision system that automatically guides and adjusts laser operations without manual intervention. The vision system provides real-time feedback and control, enabling the process to self-correct and maintain precision. This self-service capability increases throughput while the automation manages its own complexity through integrated control systems.
4Strength
If helical wrapping of the tail portion is used to create the electrode array, then a compact robust structure is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces manual helical wrapping with automated laser machining and overmolding processes. The laser system precisely cuts and shapes the polymeric material to form the helical electrode array structure with consistent geometry. This automated approach achieves the required manufacturing precision while maintaining the structural robustness of the helical configuration.
Solution Approach 2:
The patent uses light-induced polymerization to change the physical state of the polymeric material from liquid to solid during overmolding. This parameter change enables precise formation of the helical structure with controlled geometry. The rapid curing process maintains dimensional accuracy while forming the robust helical configuration, achieving both manufacturing precision and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a more compact, robust, and rapidly manufactured cochlear electrode with reduced material waste and increased throughput, minimizing mechanical stresses and breakage while improving manufacturing efficiency.
Implementation Method 1
machining a flat multiconductor microcircuit from the ribbon
Implementation Method 2
the helically wrapped tail portion is overmolded with a suitable polymeric or plastic material
Data Source
AI summary
A microcircuit integrated cochlear electrode array and a process for the manufacture thereof, the electrode array comprising a multiconductor tail portion with longitudinally spaced outwardly exposed electrode receiving pads and a flat multiconductor head portion connected to the tail portion and having spaced outwardly exposed circuit attachment pads, the tail and head portions being laminated between a nonconductive film substrate and an insulating cover and the tail portion being helically wrapped into a helix with the electrode receiving circuit attachment pads exposed and carrying ring electrodes overmolded with a suitable polymeric material.