Microcircuit Electromagnetic Wave Coupling via Resonant Structure

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Solution Overview

Problem

As clock speeds in microcircuits increase, conductor delays become a significant issue due to signal dispersion through inhomogeneous dielectric layers, limiting further improvements in reducing delays by changing conductor and dielectric materials.

Innovation Solution

The implementation of an ultra-small resonant structure within a non-conductive waveguide layer that emits electromagnetic radiation to carry and couple signals throughout the microcircuit, using a transparent waveguide layer to maintain signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If conventional conductor and dielectric materials are used, then the microcircuit structure is simple and easy to manufacture, but signal delays increase and synchronization is lost at high clock speeds

Engineering Contradiction:
Improvesignal propagation speedVSAvoidmicrocircuit structure complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent replaces the conventional electrical signal transmission through metal conductors with electromagnetic wave propagation through dielectric layers. This substitution transforms the signal carrier from electrical current in conductors to electromagnetic waves in dielectric media, enabling faster signal propagation without the limitations of conductor delay and synchronization issues.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter of signal transmission from electrical conduction to electromagnetic wave propagation. By altering the signal carrier type and transmission medium properties, the system achieves higher speeds while maintaining manufacturing feasibility through standard semiconductor processing techniques.

Inventive Principle:
Principle #35Parameter changes

2Loss of time

If conductor material is changed from aluminum to copper, then signal delay is reduced, but manufacturing complexity and processing requirements increase

Engineering Contradiction:
Improveconductor delayVSAvoidprocessing difficulty
Core Design Contradiction:
Loss of timeVSEase of manufacture

Solution Approach 1:

The patent eliminates the need for specialized conductor materials like copper by replacing the electrical conduction mechanism with electromagnetic wave propagation. This substitution removes the requirement for complex copper processing while achieving reduced signal delay through the inherent properties of dielectric waveguides.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Loss of time

If dielectric constant of dielectric layers is reduced, then capacitance between conductor and dielectric layer is reduced, but signal dispersion through inhomogeneous media increases

Engineering Contradiction:
Improvesignal delayVSAvoidsignal integrity
Core Design Contradiction:
Loss of timeVSReliability

Solution Approach 1:

The patent replaces electrical signal transmission through conductors with electromagnetic wave propagation through dielectric layers. This substitution eliminates the conductor-dielectric interface that causes capacitance effects and signal dispersion, as the electromagnetic waves propagate through the bulk dielectric material without conductor boundaries.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes the homogeneous nature of dielectric layers to guide electromagnetic wave propagation. By ensuring uniform dielectric properties throughout the waveguide layer, the system maintains signal integrity and prevents dispersion that would occur at conductor-dielectric interfaces in conventional structures.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces signal delays and maintains synchronization by carrying clock signals as electromagnetic waves through a transparent waveguide layer, allowing for faster microcircuit operation without the limitations of conventional conductor and dielectric material changes.

Implementation Method 1

an ultra-small resonant structure within a non-conductive waveguide layer that emits electromagnetic radiation to carry and couple signals throughout the microcircuit

Methodology Applied
Scientific EffectElectromagnetic radiation emission: Electromagnetic Induction

Implementation Method 2

coupling electromagnetic wave through microcircuit using a dielectric layer of the microcircuit

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Waveguide (optics)

Data Source

PatentUS7359589B2Coupling electromagnetic wave through microcircuit
Publication Date: 2008.04.15 ADVANCED PLASMONICS
  • US7359589B2 patent drawing
  • US7359589B2 patent drawing
  • US7359589B2 patent drawing

AI summary

A device includes a waveguide layer formed on a substrate. An ultra-small resonant structure emits electromagnetic radiation (EMR) in the waveguide layer. One or more circuits are formed on the waveguide layer and each operatively connected thereto to receive the EMR emitted by the ultra-small resonant structure. The waveguide layer may be transparent at wavelengths corresponding to wavelengths of the EMR emitted by the ultra-small resonant structure. The EMR may be visible light and may encode a data signal such as a clock signal.