Microstructured Component Transfer Using Stretchable Dicing Tape
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Solution Overview
Problem
There is a need for cost-effective and high-precision methods and systems to produce micro-LED displays and other microstructured components with a multiplicity of micro-functional elements on a substrate, as existing methods are inefficient in achieving economic fabrication while maintaining high quality.
Innovation Solution
The method involves using a dicing tape with an elastically stretchable base film and an adhesive layer as a transfer substrate, clamped in a clamping frame under surface tension, to temporarily fix and transfer micro-functional elements from a first substrate to a second substrate, utilizing laser processing for precise control and adhesion manipulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional transfer substrates are used for transferring micro-functional elements, then the transfer process can be performed, but the production efficiency and flexibility are limited
Solution Approach 1:
The dicing tape is elastically stretchable and can be dynamically adjusted in tension. The base film is stretched during mounting to ensure planarity and contact, then relaxed during transfer to enable easy release of micro-functional elements. This dynamic mechanical property allows the same substrate to serve multiple functions in different process stages, improving productivity without adding complex equipment.
2Ease of operation
If a dicing tape with adhesive layer is used as transfer substrate, then the flexibility and ease of operation improve, but the control of adhesion and release becomes more challenging
Solution Approach 1:
The adhesion parameters of the adhesive layer are precisely controlled by adjusting the mounting pressure and temperature. During mounting, high pressure ensures strong adhesion; during transfer, reduced pressure allows easy release. This parameter control enables the adhesive layer to provide both strong bonding and easy release functions, improving ease of operation while maintaining manufacturing precision.
3Adaptability or versatility
If multiple transfer steps are used to achieve flexible arrangement, then the adaptability improves, but the process time and complexity increase
Solution Approach 1:
The dicing tape with adhesive layer serves multiple functions: it acts as a mounting substrate for picking up micro-functional elements, a transfer substrate for transporting them, and a release substrate for placing them on the target substrate. This multi-functionality eliminates the need for separate functional substrates for each transfer step, reducing process time while maintaining flexibility of arrangement.
4Manufacturing precision
If elastically stretchable base film is used under surface tension, then the planarity and contact improve, but the device complexity increases
Solution Approach 1:
The elastically stretchable base film is a thin, flexible membrane that can be mounted on a simple clamping frame. When stretched, it becomes planar and maintains good contact with the micro-functional elements. The flexibility of the thin film allows it to conform to the clamping frame structure without requiring complex rigid support structures, achieving manufacturing precision with minimal device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective and high-precision transfer of micro-functional elements, allowing for flexible arrangement and increased production efficiency in micro-LED displays and other microstructured components, while maintaining the quality of the end product.
Implementation Method 1
an adhesive layer (104) attached to one side of the base film for temporarily fixing micro-functional units to the dicing tape
Implementation Method 2
utilizing laser processing for precise control and adhesion manipulation
Data Source
AI summary
A method and a system of producing a microstructured component includes a multiplicity of micro-functional elements on a substrate, wherein laser processing is carried out in at least one method stage in a laser processing station under the control of a control unit. One preferred field of application is the production of a micro-LED display including a substrate which carries an array of pixel-forming micro-light-emitting diodes arranged on an electrical supply structure arranged on the substrate.


