Microcontact Printing of Graphite Nanoplatelets

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Solution Overview

Problem

Current methods for depositing conductive materials onto substrates, such as photolithography, are expensive and limited in material options, and require flat surfaces, which is not suitable for growing electronic applications like RFID and EMI shielding that need low-cost fabrication on flexible surfaces.

Innovation Solution

The method involves using polyelectrolyte multilayer coating or silane self-assembly combined with microcontact printing and conductive graphite particles, specifically exfoliated graphite nanoplatelets coated with charged polymers, to create conductive patterns on both flat and curved surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If photolithography is used to form metal patterns, then manufacturing precision and reliability are improved, but manufacturing cost increases and material options are limited

Engineering Contradiction:
Improvepattern formation precisionVSAvoidfabrication cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent uses microcontact printing to create a physical copy of the pattern from a stamp onto the substrate. The stamp surface is prepared with a self-assembled monolayer that transfers conductive material in the desired pattern, eliminating the need for expensive photolithography equipment and processes while maintaining pattern precision

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent employs disposable stamps and self-assembled monolayers that can be prepared once and used for pattern transfer. These low-cost, single-use components replace expensive and complex photolithography tools, significantly reducing manufacturing costs while achieving the required pattern fidelity

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Manufacturing precision

If photolithography is used to form metal patterns, then manufacturing precision is improved, but material options are limited

Engineering Contradiction:
Improvepattern formation precisionVSAvoidmaterial selection range
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The microcontact printing method serves multiple functions: it can transfer various conductive materials (graphite, metal particles, conductive polymers), work on different substrate types (flexible and rigid), and create diverse patterns. This universal approach replaces the material-specific constraints of photolithography with a versatile platform suitable for multiple conductive materials

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent changes the fundamental parameters of the patterning process by switching from chemical etching and deposition (photolithography) to physical contact transfer (microcontact printing). This parameter change enables the use of materials that are incompatible with traditional photolithography, such as flexible substrates and various conductive particulate materials

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If photolithography is used to form metal patterns, then manufacturing precision is improved, but the method requires flat substrates

Engineering Contradiction:
Improvepattern formation precisionVSAvoidsubstrate geometry compatibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent explicitly addresses curved and flexible substrates by using microcontact printing, which can conform to non-planar surfaces. The stamp makes contact with the substrate along its surface, allowing pattern transfer on curved, flexible, or irregular geometries that cannot accommodate traditional flat-plate photolithography processes

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent enables dynamic adaptation to different substrate geometries by using flexible stamps and conformal contact printing. The system can adjust to various substrate shapes and flexibilities, transforming the static, rigid process of photolithography into a dynamic, adaptable process suitable for diverse substrate forms

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for cost-effective deposition of conductive materials on various surfaces, including flexible ones, enabling efficient microelectronic device fabrication with improved conductivity and surface resistivity.

Implementation Method 1

The polymer coated graphite particle, which has an effective negative charge, is then patterned using microcontact printing on a substrate that has a surface charged oppositely to the graphite particle

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

the charged surface on the substrate is provided by a polyelectrolyte multilayer or a self assembled monolayer

Methodology Applied
Scientific EffectElectrostatic adsorption: Adsorption

Data Source

PatentUS9023478B2Micropatterning of conductive graphite particles using microcontact printing
Publication Date: 2015.05.05 BOARD OF TRUSTEES OPERATING MICHIGAN STATE UNIV
  • US9023478B2 patent drawing
  • US9023478B2 patent drawing
  • US9023478B2 patent drawing

AI summary

Methods involve a combination of polyelectrolyte multilayer (PEM) coating or silane self assembly on a substrate; microcontact printing; and conductive graphite particles, especially size controlled highly conductive exfoliated graphite nanoplatelets. The conductive graphite particles are coated with a charged polymer such as sulfonated polystyrene. The graphite particles are patterned using microcontact printing and intact pattern transfer on a substrate that has an oppositely-charged surface. The method allows for conductive organic patterning on both flat and curved surfaces and can be used in microelectronic device fabrication.