Micro-Device Transfer Using Selective Adhesive Spacing Control
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Solution Overview
Problem
Existing manufacturing processes for display panels face challenges in efficiently transferring micro-devices from a donor substrate to a destination substrate, particularly in achieving precise spacing and high throughput, especially when the destination substrate is incompatible with fabrication processes, leading to low yield and high costs.
Innovation Solution
A system that selectively dispenses adhesive onto micro-devices on the donor substrate based on desired spacing, using a transfer device to adhere and transfer the micro-devices to the destination substrate, with optional features like defect detection and secondary transfer devices to fill gaps, enabling precise placement and high-density transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro-devices are transferred using conventional methods, then transfer is achieved, but spacing precision and yield are insufficient
Solution Approach 1:
The patent applies preliminary action by pre-forming micro-devices on a donor substrate with precise spacing before transfer. The micro-devices are fabricated on the donor substrate using standard semiconductor fabrication processes, ensuring precise spacing is achieved during the fabrication stage rather than during transfer. This preliminary precision work enables high-yield transfer to the destination substrate.
Solution Approach 2:
The patent uses a donor substrate as an intermediary carrier to hold precisely-spaced micro-devices before transfer. The donor substrate serves as a temporary platform that maintains precise spacing during fabrication, then facilitates controlled transfer to the destination substrate. This intermediary approach decouples the precision fabrication process from the transfer process, allowing both to be optimized independently.
2Ease of manufacture
If micro-devices are fabricated directly on the destination substrate, then integration is achieved, but the destination substrate cannot withstand fabrication processes
Solution Approach 1:
The patent segments the manufacturing process into two distinct stages: (1) fabrication of micro-devices on a donor substrate that can withstand high-temperature and chemically aggressive fabrication processes, and (2) transfer of the completed micro-devices to the destination substrate. This segmentation allows the destination substrate to be protected from harsh fabrication conditions while still achieving integrated device-substrate structure.
Solution Approach 2:
The donor substrate acts as an intermediary that temporarily hosts the micro-devices during fabrication. It serves as a protective platform that can endure fabrication processes, then enables controlled transfer to the destination substrate. This intermediary approach protects the destination substrate from fabrication damage while achieving the desired integrated structure.
3Manufacturing precision
If selective adhesive dispensing is used, then precise spacing is achieved, but transfer complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-establishing precise spacing during micro-device fabrication on the donor substrate. Because the spacing is already determined during fabrication, the subsequent adhesive dispensing and transfer operations become simpler routine processes rather than complex precision operations. The difficult precision work is done beforehand during fabrication.
4Productivity
If high-density transfer is implemented, then throughput increases, but spacing control becomes more difficult
Solution Approach 1:
The patent performs preliminary precision spacing during the fabrication stage on the donor substrate, before high-density transfer. This allows hundreds or thousands of micro-devices to be transferred in parallel or in batches without compromising spacing control, because the spacing was already established during fabrication when precision tools were available.
Solution Approach 2:
The donor substrate serves as an intermediary that maintains precise spacing information through the transfer process. It acts as a template that preserves the spatial arrangement of micro-devices, enabling high-density transfer while maintaining spacing control. The donor substrate's structured array guides the transfer process to preserve precision even at high throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective and high-performance display panel manufacturing by enabling precise spacing and high-density transfer of micro-devices, increasing yield and reducing manufacturing time and cost, while ensuring only functional devices are used.
Implementation Method 1
an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate
Implementation Method 2
the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface
Data Source
AI summary
An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.