Micro-device Transfer via Electrostatic Force Differential
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Solution Overview
Problem
The existing micro-device transfer technologies are inefficient due to the need for precise alignment of lug protrusions on a transfer stamp with micro-light emitting diodes on a growth substrate, which increases the time and effort required for transferring micro-devices, such as in the manufacturing of optical touch sensing panels.
Innovation Solution
A method involving a carrying unit with electrodes and a dielectric layer, where a voltage is applied to create differential electrostatic forces between micro-devices, allowing a transfer stamp with a continuous transfer plane to pick up the desired micro-device without aligning lug protrusions, thereby reducing the number of alignment steps and increasing transfer speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lug protrusions on the transfer stamp are used to adhere and pick up micro-light emitting diodes, then the micro-devices can be transferred from the growth substrate to the touch substrate, but precise alignment between the lug protrusions and micro-devices is required which increases the time and effort for the transfer process
Solution Approach 1:
The patent replaces the mechanical alignment system (lug protrusions requiring precise physical alignment) with an electrostatic field-based system. electrodes on the growth substrate generate electrostatic forces that automatically hold micro-devices in position during transfer, eliminating the need for mechanical alignment features and significantly reducing alignment time while maintaining transfer accuracy
Solution Approach 2:
The patent changes the physical state and interaction parameters by using electrostatic forces instead of mechanical contact. By controlling voltage applied to electrodes, the electrostatic force can be adjusted to precisely control the adhesion and release of micro-devices, enabling rapid transfer without mechanical alignment
2Productivity
If micro-light emitting diodes are arranged in high density on the growth substrate to improve usage efficiency, then more devices can be manufactured, but the complexity of aligning and picking up individual devices increases
Solution Approach 1:
The electrostatic field system replaces complex mechanical alignment mechanisms, allowing high-density arrays of micro-devices to be manipulated collectively or individually through electric field control rather than requiring complex mechanical positioning for each device
Solution Approach 2:
The electrode system serves multiple functions simultaneously: it can address individual micro-devices or groups of devices, control adhesion strength through voltage adjustment, and enable both picking up and releasing operations without requiring different mechanical tools or alignment mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid and accurate transfer of micro-devices by eliminating the need for precise alignment of lug protrusions, enhancing the efficiency of micro-device transfer processes.
Implementation Method 1
applying a voltage to an electrode corresponding to the first micro-device, so that an electrostatic force F1 generated on the first micro-device by the carrying unit is larger than an electrostatic force F2 generated on the second micro-device by the carrying unit
Data Source
AI summary
A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.