Microdevice Substrate Integration With Filler and Reflective Layers
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Solution Overview
Problem
Existing micro device systems face challenges in enhancing the performance of transferred micro devices on a receiver substrate, particularly in terms of light outcoupling and integration with electro-optical thin film devices.
Innovation Solution
The implementation of post-processing steps such as patterning filler layers to extend the active area of micro devices, using reflective layers to confine light, and integrating dielectric and metallic layers for electro-optical thin film device integration, enhances the performance of micro devices on the receiver substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the active area of micro devices is extended using fillers, then the light outcoupling is improved, but the manufacturing complexity increases
Solution Approach 1:
A dielectric filler layer is introduced as an intermediary material between the micro device and the substrate. This filler layer extends the optical path length and improves light outcoupling efficiency by mediating the optical interaction between the micro device and the surrounding environment, thereby resolving the contradiction between light outcoupling performance and manufacturing complexity.
Solution Approach 2:
The refractive index and thickness parameters of the filler layer are optimized to maximize light outcoupling. By changing these parameters, the optical performance is improved without requiring fundamental changes to the manufacturing process, thus addressing the contradiction between performance enhancement and manufacturing complexity.
2Illumination intensity
If reflective layers are added to confine light, then the light confinement efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The reflective layer is merged with the existing substrate structure or integrated into the filler layer system. This combination approach provides effective light confinement while avoiding the need for separate, complex reflective components, thus resolving the contradiction between light confinement efficiency and device structure complexity.
Solution Approach 2:
The substrate or filler layer is designed to serve multiple functions: providing mechanical support, enabling light outcoupling, and simultaneously acting as a reflective layer for light confinement. This multi-functionality reduces the overall device structure complexity while maintaining high light confinement efficiency.
3Adaptability or versatility
If electro-optical thin film devices are integrated into the system substrate, then the functionality is enhanced, but the integration process becomes more difficult
Solution Approach 1:
The system substrate is prepared in advance with pre-defined contact pads, alignment marks, and optimized geometric patterns before the electro-optical thin film devices are transferred. This preliminary preparation simplifies the subsequent integration process by reducing alignment complexity and facilitating easier device placement, thereby resolving the contradiction between enhanced functionality and integration difficulty.
Solution Approach 2:
A transfer substrate or intermediate carrier is used to facilitate the integration of electro-optical thin film devices onto the system substrate. This intermediary enables controlled transfer and precise positioning, simplifying the integration process while maintaining enhanced functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These post-processing steps improve light outcoupling and integration efficiency, leading to enhanced performance and functionality of micro devices in micro device systems.
Implementation Method 1
at least one reflective layer covering at least a portion of one side of the patterned filler layer, the reflective layer for confining at least a portion of incoming or outgoing light within the active area of the sub-pixel
Data Source
AI summary
Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.