Microdevice Test Electrode Access for Hidden Contacts

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing microdevice inspection processes face challenges in accessing hidden contacts within microdevices, which hinders effective defect identification and performance analysis.

Innovation Solution

The method involves forming test electrodes to access both hidden and accessible contacts in microdevices, including vertical, flip chip, and lateral microdevices, by creating openings in dielectric layers and forming electrodes outside the microdevice to connect to internal contacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dielectric layers are used to cover microdevice surfaces and sidewalls, then device protection and insulation are improved, but access to hidden contacts becomes difficult

Engineering Contradiction:

Improvedevice protectionVSAvoidaccess to hidden contacts

Core Design Contradiction:

ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The dielectric layer is segmented by forming localized openings (via holes) through it, allowing access to hidden contacts while maintaining coverage over other areas. This segmentation enables simultaneous protection and access functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Test electrodes are introduced as intermediary elements that bridge the external measurement equipment and the hidden contacts. These electrodes pass through the dielectric openings and make contact with the hidden contacts, enabling measurement without compromising the dielectric's protective function.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Difficulty of detecting and measuring

If openings are formed in dielectric layers to access hidden contacts, then measurement capability is improved, but device structure complexity increases

Engineering Contradiction:

Improvemeasurement capabilityVSAvoidstructure complexity

Core Design Contradiction:

Difficulty of detecting and measuringVSDevice complexity

Solution Approach 1:

The openings in the dielectric layer and the test electrodes are formed during the microdevice fabrication process, before the device is fully assembled and sealed. This preliminary action integrates the measurement access into the manufacturing flow without requiring complex post-processing steps.

Inventive Principle:

Principle #10Preliminary action

3Measurement precision

If multiple contacts are made accessible for inspection, then defect identification capability is improved, but inspection process time increases

Engineering Contradiction:

Improvedefect identification capabilityVSAvoidinspection process time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

Multiple test electrodes are combined into a single integrated inspection setup, allowing simultaneous or sequential measurement of multiple contacts without requiring separate inspection procedures for each contact. This merging reduces the overall inspection time while maintaining comprehensive defect detection capability.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12237236B2Cartridge for inspection

Publication Date: 2025.02.25 VUEREAL INC

AI summary

The present invention relates to the inspection process which includes providing access to the microdevice contacts, measuring the microdevice and analyzing the data to identify defects or performance of the micro device. The invention also relates to the forming of test electrodes on microdevices. The test electrodes may be connected to hidden contacts. The type of microdevices may be vertical, lateral or a flip chip.