Microdevice Substrate Integration With Reflective Layers for Yield
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Solution Overview
Problem
The challenge lies in efficiently integrating millions of microdevices with circuits on a system substrate with high yield, as existing methods are costly, time-consuming, and face issues with structural non-uniformity and bonding repeatability.
Innovation Solution
A method involving transferring microdevices to a substrate, forming a protective layer, patterning it for conductive electrodes, and connecting backplane elements, which includes using reflective layers to enhance light output uniformity and integrating color conversion layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microdevices are transferred and integrated with circuits on a system substrate, then system performance is improved, but the process becomes costly and time-consuming with low yield
Solution Approach 1:
The system is divided into separate functional modules: microdevices are fabricated on a first substrate, circuits are formed on a second substrate, and these modules are subsequently integrated through transfer and bonding processes. This segmentation allows parallel processing of different components, improving overall integration efficiency and yield while maintaining system performance.
2Adaptability or versatility
If microdevices are transferred and integrated with circuits, then system functionality is enhanced, but structural non-uniformity and bonding repeatability issues arise
Solution Approach 1:
Transfer substrates are introduced as intermediary carriers that facilitate the movement of microdevices from fabrication substrates to circuit substrates. These transfer substrates provide standardized interfaces and control mechanisms that ensure precise positioning and repeatable bonding, thereby improving manufacturing precision without compromising system functionality.
3Illumination intensity
If reflective layers are added to improve light output uniformity, then optical performance is enhanced, but device complexity increases
Solution Approach 1:
Reflective layers are selectively applied only in regions where light output uniformity needs improvement, rather than uniformly across the entire device. This localized approach enhances optical performance in critical areas while minimizing the increase in overall device complexity and maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the integration process efficiency, reduces costs, and enhances light uniformity and yield, addressing structural non-uniformity and bonding challenges.
Implementation Method 1
light sources sandwiched between two reflective layers with at least one patterned reflective layer
Data Source
AI summary
An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.