Microdevice Substrate Integration for Better LED Light Outcoupling
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Solution Overview
Problem
Existing micro device systems face challenges in enhancing the performance of transferred micro devices on a receiver substrate, particularly in terms of light outcoupling and integration with electro-optical thin film devices.
Innovation Solution
The implementation of post-processing steps such as patterning filler layers to extend the active area of micro devices, using reflective layers to confine light, and integrating dielectric and metallic layers for electro-optical thin film devices, enhances the performance of micro devices on the receiver substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro devices are transferred onto a receiver substrate, then device integration is achieved, but light outcoupling efficiency is insufficient
Solution Approach 1:
A filler layer is introduced as an intermediary material between the micro device and the receiver substrate. This filler layer has a refractive index matched to the micro device, creating an optical impedance match that reduces total internal reflection at the interface and improves light outcoupling efficiency without interfering with device integration
Solution Approach 2:
The refractive index parameter of the interface region is modified by introducing the filler layer with a specific refractive index value that matches the micro device. This parameter change optimizes the optical properties at the interface, enabling improved light extraction while maintaining device functionality
2Loss of energy
If the active area of micro devices is extended using fillers, then light outcoupling is improved, but device complexity increases
Solution Approach 1:
The filler layer is selectively applied only in the active area regions where light outcoupling enhancement is needed, rather than uniformly across the entire device. This segmented approach improves light extraction where necessary while minimizing additional structural complexity and material usage
3Adaptability or versatility
If electro-optical thin film devices are integrated onto the receiver substrate, then system functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The receiver substrate is prepared with pre-formed contact pads, conductive traces, and structural features before the electro-optical thin film devices are transferred or deposited. This preliminary preparation of the substrate simplifies subsequent integration steps and reduces manufacturing complexity by establishing the electrical and mechanical framework in advance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These post-processing steps improve the light outcoupling efficiency and enable effective integration of micro devices with electro-optical thin film devices, leading to enhanced performance and functionality of the micro device systems.
Implementation Method 1
fabricating at least one reflective layer covering at least a portion of one side of the patterned filler layer, the reflective layer for confining at least a portion of incoming or outgoing light within the active area of the sub-pixel
Data Source
AI summary
Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.