Microdevice Transfer Offset Correction and Void Repair
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Solution Overview
Problem
Existing microdevice transfer processes face challenges with misalignment and voids, which affect the accuracy and completeness of the transfer process, particularly when transferring microdevices from a donor substrate to a system substrate.
Innovation Solution
A method is introduced to correct misalignment by calculating an offset vector based on misalignment information and using it for subsequent transfers, and to populate voids by forming new pads on the system substrate and aligning microdevices to these pads for secure transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microdevices are transferred from donor substrate to system substrate, then productivity is improved, but misalignment occurs reducing manufacturing precision
Solution Approach 1:
The system captures images of transferred microdevices, calculates their actual positions, determines offset vectors from intended positions, and uses this feedback to correct alignment for subsequent transfers. This closed-loop feedback mechanism maintains manufacturing precision while enabling continuous high-productivity transfer operations.
Solution Approach 2:
The system performs alignment calculations and determines offset vectors in advance before executing the next transfer operation. By pre-calculating correction values based on previous transfer accuracy, the system prepares alignment corrections proactively, ensuring precision is maintained without interrupting the transfer workflow.
2Manufacturing precision
If alignment correction is performed for each transfer, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The system performs alignment verification and offset calculation only when necessary - specifically after transfers that may have incurred misalignment. Rather than performing full alignment procedures after every single transfer, the system applies corrections selectively based on detected positioning errors, reducing time loss while maintaining precision where needed.
Solution Approach 2:
The alignment correction process is integrated into the continuous transfer workflow without interrupting it. Image capture, offset calculation, and correction application occur as seamless parts of the transfer cycle, ensuring useful action continues uninterrupted while maintaining precision.
3Device complexity
If multiple transfer heads share alignment system, then device complexity is reduced, but ease of operation deteriorates
Solution Approach 1:
A single alignment system is designed to serve multiple transfer heads universally. The same imaging and calculation infrastructure is used by all transfer heads, eliminating the need for separate alignment systems for each head. This multi-functional approach reduces overall device complexity while the centralized control software manages coordination automatically.
Solution Approach 2:
Each transfer head autonomously uses the shared alignment system to determine its own offset vector and perform self-correction. The transfer heads don't require manual alignment adjustment or complex coordinated control - they independently query the alignment system, receive their specific correction values, and apply them automatically, simplifying operation.
Data Source
AI summary
This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.