Microdevice Substrate Integration With Preformed Electrode Connections

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Solution Overview

Problem

The challenge lies in efficiently integrating millions of microdevices with circuits on a system substrate with proper yield, particularly due to issues with transfer processes and bonding, which are time-consuming and affect yield and reliability.

Innovation Solution

A method involving transferring microdevices to a substrate, forming a protective layer, patterning it for conductive electrodes, and connecting backplane elements, which enhances integration efficiency and reduces processing time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional transfer processes and bonding methods are used to integrate microdevices with circuits, then integration can be achieved, but the process is time-consuming and yield is reduced

Engineering Contradiction:

Improveintegration speedVSAvoidyield

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-forming conductive electrodes and bonding structures on the substrate before transferring microdevices. This allows bonding surfaces to be prepared in advance, eliminating time-consuming post-transfer bonding operations and improving both integration speed and yield.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the integration process into distinct stages: substrate preparation with pre-formed electrodes, microdevice transfer, and final assembly. This segmentation allows each stage to be optimized independently, with the substrate preparation stage completing bonding surface formation before microdevices are transferred, thereby reducing overall process time and improving yield.

Inventive Principle:

Principle #1Segmentation

2Reliability

If traditional bonding processes are used, then microdevices can be connected to circuits, but processing time increases and reliability decreases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidprocessing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent performs preliminary action by forming conductive electrodes and bonding structures on the substrate before microdevice transfer. This ensures bonding surfaces are ready in advance, eliminating time-consuming post-transfer bonding steps while ensuring reliable connections are established from the outset.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent inverts the traditional sequence by preparing bonding surfaces on the substrate first, then transferring microdevices to connect to pre-formed electrodes. This reversal of the conventional approach (where devices are transferred first then bonded) reduces processing time while maintaining connection reliability.

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentUS20250267988A1Circuit and system integration onto a microdevice substrate

Publication Date: 2025.08.21 VUEREAL INC

AI summary

An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.